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CD214L-T40CALF

Description
ESD Suppressors / TVS Diodes TVS Bidirect Diode
CategoryDiscrete semiconductor    diode   
File Size333KB,5 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
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CD214L-T40CALF Overview

ESD Suppressors / TVS Diodes TVS Bidirect Diode

CD214L-T40CALF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
Parts packaging codeDO-214AB
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time25 weeks 5 days
Maximum breakdown voltage49.1 V
Minimum breakdown voltage44.4 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation5 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage40 V
surface mountYES
technologyAVALANCHE
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
CO
M
PL
IA
Features
RoHS compliant*
Surface Mount SMC package
Standoff Voltage: 5.0 to 170 volts
Power Dissipation: 3000 watts
Model CD214L is currently available,
although not recommended for new
designs. Model
SMLJ
is preferred.
*R
oH
S
NT
CD214L Transient Voltage Suppressor Diode Series
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly
smaller electronic components.
Bourns offers Transient Voltage Suppressor Diodes for surge and ESD protection applications, in compact chip package DO-214AB (SMC)
size format. The Transient Voltage Suppressor series offers a choice of Working Peak Reverse Voltage from 5 V up to 170 V and Breakdown
Voltage up to 200 V. Typical fast response times are less than 1.0 ns for unidirectional devices and less than 5.0 ns for bidirectional devices
from 0 V to Minimum Breakdown Voltage.
Bourns
®
Chip Diodes conform to JEDEC standards, are easy to handle with standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ TA = 25
°C
Unless Otherwise Noted)
Parameter
Symbol
(Note 1,2)
Value
Unit
Minimum Peak Pulse Power Dissipation (TP = 1 ms)
Peak Forward Surge Current
8.3ms Single Half Sine Wave Superimposed on Rated Load
(JEDEC Method)
(Note 3)
Steady State Power Dissipation @ TL = 75 °C
Maximum Instantaneous Forward Voltage @ IPP = 100 A
(For Unidirectional Units Only)
Operating Temperature Range
Storage Temperature Range
1.
2.
3.
4.
5.
PPK
IFSM
PM(AV)
VF
TJ
TSTG
3000
300
5.0
(Note 5)
Watts
Amps
Watts
Volts
°C
°C
-55 to +150
-55 to +175
Non-repetitive current pulse, per Pulse Waveform graph and derated above TA = 25 °C per Pulse Derating Curve.
Thermal Resistance Junction to Lead.
8.3 ms Single Half-Sine Wave duty cycle = 4 pulses maximum per minute (unidirectional units only).
Single Phase, Half Wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20 %.
VF = 3.5 V on CD214L-T5.0ALF through CD214L-T90ALF and VF = 5.0 V on CD214L-T100ALF through CD214L-T170ALF.
How To Order
CD 214L - T 5.0 CA LF
Common Code
Chip Diode
Package
214L = 3 kW SMC/DO-214AB
Model
T = Transient Voltage Suppressor Series
Working Peak Reverse Voltage
5.0 = 5.0 VRWM (Volts)
170 = 170 VRWM (Volts)
Suffix
A = 5 % Tolerance Device
CA = 5 % Tolerance Bidirectional Device
Terminations
LF = 100 % Sn (RoHS Compliant)
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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