Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Derate linearly 1.33 mW /
ºC
Derate linearly 6.67 mW /
ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current (Continuous)
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
F
=50mA
I
F
=80mA
V
L
=300V
V
L
=100V
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
60
15
-
1
25
42
3
1.35
1.25
2.4
-
3
50
80
±200
100
30
25
10
mA
rms
/ mA
DC
mA
DC
mA
P
nA
R
ON
I
LEAK
I
F
=10mA, V
L
=10V
50V, f=1MHz
I
L
=50mA
-
I
F
=10mA
V
R
=5V
-
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
0.4
1.8
-
-
50
-
10
-
2.8
10
-
s
pF
mA
mA
V
µA
pF
2
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NTEGRATED
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IRCUITS
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IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
2.34
2.38
2.42
2.46
2.50
LED Forward Voltage Drop (V)
Device Count (N)
25
20
15
10
5
0
19
21
23
25
27
Turn-On Time ( s)
29
31
PLA160
Turn-On Time Distribution
(N=50, I
F
=10mA, I
L
=50mA)
30
25
Device Count (N)
20
15
10
5
0
38
Turn-Off Time Distribution
(N=50, I
F
=10mA, I
L
=50mA)
40
42
44
46
Turn-Off Time ( s)
48
30
25
Device Count (N)
Typical I
F
for Switch Operation
(N=50, I
L
=50mA
DC
)
30
25
Device Count (N)
Typical I
F
for Switch Dropout
(N=50, I
L
=50mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=50mA
DC
)
20
15
10
5
0
0.9
1.1
1.3
1.5
1.7
LED Current (mA)
1.9
20
15
10
5
0
0.9
1.1
1.3
1.5
1.7
1.9
LED Current (mA)
60
61
62
63
64
On-Resistance ( )
65
Typical Blocking Voltage Distribution
(N=50)
18
16
Device Count (N)
14
12
10
8
6
4
2
0
335
340
345 350
355 360
Blocking Voltage (V
P
)
365
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
3.6
3.2
2.8
2.4
2.0
1.6
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
45
40
35
30
25
20
15
10
5
0
Typical Turn-On Time
vs. LED Forward Current
(V
L
=10V, I
L
=50mA)
50
48
Turn-Off Time ( s)
46
44
42
40
38
Typical Turn-Off Time
vs. LED Forward Current
(V
L
=10V, I
L
=50mA)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
Turn-On Time ( s)
10
20
30
LED Current (mA)
40
50
0
10
20
30
LED Current (mA)
40
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
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I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time vs. Temperature
(V
L
=10V)
I
F
=10mA
Turn-Off Time ( s)
On-Resistance ( )
50
I
F
=20mA
45
40
I
F
=10mA
35
30
-40
PLA160
35
30
Turn-On Time ( s)
25
55
Typical Turn-Off Time vs. Temperature
(V
L
=10V)
80
70
60
50
40
30
20
10
Typical On-Resistance
vs. Temperature
(I
L
=50mA
DC
, I
F
=10mA)
I
F
=20mA
20
15
10
5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
6
5
LED Current (mA)
4
3
2
1
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=50mA
DC
)
6
5
LED Current (mA)
4
3
2
1
0
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=50mA
DC
)
Load Current (mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
80
100
50
40
30
20
10
0
-10
-20
-30
-40
-50
Typical Load Current vs. Load Voltage
(I
F
=10mA)
-3
-2
Temperature (ºC)
-1
0
1
Load Voltage (V)
2
3
Maximum Load Current
vs. Temperature
80
Blocking Voltage (V
P
)
70
Load Current (mA)
60
50
40
30
20
10
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
380
375
370
365
360
355
350
345
340
335
-40
Typical Blocking Voltage
vs. Temperature
0.07
0.06
Leakage ( A)
0.05
0.04
0.03
0.02
0.01
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
(V
L
=300V
P
)
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
0.45
0.40
Load Current (A)
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
1s
10s
100s
4
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IRCUITS
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IVISION
Manufacturing Information
Moisture Sensitivity
PLA160
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA160 / PLA160S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA160 / PLA160S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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