SAM87 family of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | DIP |
package instruction | SDIP, |
Contacts | 42 |
Reach Compliance Code | unknow |
Has ADC | YES |
Address bus width | |
bit size | 8 |
maximum clock frequency | 8 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | |
JESD-30 code | R-PDIP-T42 |
length | 39.1 mm |
Number of I/O lines | 28 |
Number of terminals | 42 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -20 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | SDIP |
Package shape | RECTANGULAR |
Package form | IN-LINE, SHRINK PITCH |
Certification status | Not Qualified |
ROM programmability | MROM |
Maximum seat height | 5.08 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | OTHER |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.778 mm |
Terminal location | DUAL |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
KS88C8316 | KS88P8324 | KS88C8324 | |
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Description | SAM87 family of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU | SAM87 family of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU | SAM87 family of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU |
Maker | SAMSUNG | - | SAMSUNG |
Parts packaging code | DIP | - | DIP |
package instruction | SDIP, | - | SDIP, |
Contacts | 42 | - | 42 |
Reach Compliance Code | unknow | - | unknow |
Has ADC | YES | - | YES |
bit size | 8 | - | 8 |
maximum clock frequency | 8 MHz | - | 8 MHz |
DAC channel | NO | - | NO |
DMA channel | NO | - | NO |
JESD-30 code | R-PDIP-T42 | - | R-PDIP-T42 |
length | 39.1 mm | - | 39.1 mm |
Number of I/O lines | 28 | - | 28 |
Number of terminals | 42 | - | 42 |
Maximum operating temperature | 85 °C | - | 85 °C |
Minimum operating temperature | -20 °C | - | -20 °C |
PWM channel | YES | - | YES |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
encapsulated code | SDIP | - | SDIP |
Package shape | RECTANGULAR | - | RECTANGULAR |
Package form | IN-LINE, SHRINK PITCH | - | IN-LINE, SHRINK PITCH |
Certification status | Not Qualified | - | Not Qualified |
ROM programmability | MROM | - | MROM |
Maximum seat height | 5.08 mm | - | 5.08 mm |
Maximum supply voltage | 5.5 V | - | 5.5 V |
Minimum supply voltage | 4.5 V | - | 4.5 V |
Nominal supply voltage | 5 V | - | 5 V |
surface mount | NO | - | NO |
technology | CMOS | - | CMOS |
Temperature level | OTHER | - | OTHER |
Terminal form | THROUGH-HOLE | - | THROUGH-HOLE |
Terminal pitch | 1.778 mm | - | 1.778 mm |
Terminal location | DUAL | - | DUAL |
width | 15.24 mm | - | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | - | MICROCONTROLLER |