DA-T268-301E datasheet, PDF - EEWORLD Datasheet

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DA-T268-301E: DescriptionHeat Sinks HEATSINK FOR TO-268; CategoryThermal management products Heat resisting bracing; File Size399KB，2 Pages; ManufacturerOhmite; Websitehttps://www.ohmite.com; Environmental Compliance

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DA-T268-301E Overview

Heat Sinks HEATSINK FOR TO-268

DA-T268-301E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Ohmite
Reach Compliance Code	compliant
Heat Resistant Support Device Type	HEAT SINK

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D Series

Heatsink For TO-252, TO-263

and TO-268 devices

Ohmite D Series heatsinks provide an innovative

solution for SMT compatible semiconductors and

resistors. The unique design (Patent Pending) com-

bines tin plated, solderable rods with an aluminum

extruded heat sink body. These rods (or “rollers”)

are mated mechanically to the heatsink by forging to

reduce the thermal resistance between the heatsink

body and the solderable feet.

Specifically designed for use with the increasingly

popular TO-252, TO-263 and TO-268 packages, the

D Series affords the user superior thermal perfor-

mance over the more common stamped aluminum

heatsinks. By eliminating the staking joint typically

used in stamped heatsinks, the resulting air gap and

thermal “bottle-neck” is also eliminated, while sur-

face area for cooling is maximized with the extruded

fins of the D Series body.

Air Velocity (ft./min.)

Case Temp. Rise above

Ambient ( C)

200

400

600

800

1000

Thermal Resistance from Mounting

Surface to Ambient ( C/watts)

200

F e at u r e S

• Increased surface areas by 3 times therefore ther-

mal performance up to 300% over the aluminum

stamped heat sinks on markets

• Light weight aluminum construction allows faster

pick and place assembly reducing the manufactur-

ing cycle time

• Radius mounted “Rollers” are designed for maxi-

mizing heat transfer from the component and

avoiding the thermal “bottle-neck” seen in stamped

and staked heatsinks.

• Available in bulk packaging or tape & reel (250

units per reel

• RoHS Compliant

Air Velocity (ft./min.)

400

600

800

1000

Thermal Resistance from Mounting

Surface to Ambient ( C/watts)

H e at D i S S i pat i o n

Case Temp. Rise above

Ambient ( C)

TO-252 (D)

TO-263 (D2)

101 & 201

TO-268 (D3)

101 & 201

Final thermal performance

is highly dependent on the

thermal characteristics of

the PCB. It is possible to see

a 50% drop in temp rise in

natural convection with a

thermally improved PCB.

301

Heat Dissipated (watts)

301

Heat Dissipated (watts)

DimenSionS

±0.012” / ±0.30mm

Style 10

TO-252 (D)

TO-263 (D2) TO-268 (D3)

1.02"

1.22"

25.91mm

30.9mm

Style 20

1.02"

25.9mm

0.50"

12.7mm

Style 30

TO-268 (D3) TO-263 (D2)

1.58"

1.39"

40.2mm

35.2mm

0.50"

12.7mm

0.40"

10.16mm

0.10"

2.54mm

0.27"

6.86mm

0.44"

(11.2mm)

0.56"

(14.2mm)

0.64"

(16.2mm)

0.76"

(19.2mm)

0.48"REF

12.1mm

0.26"

6.6mm

0.44"

11.1mm

0.56"

14.1mm

0.46"

11.6mm

0.09"

2.3mm

0.15"

3.7mm

0.26"

6.6mm

TO-268 (D3)

0.64"

16.2mm ±0.2

0.76"

19.2mm ±0.2

TO-263 (D2)

0.44"

11.2mm

0.56"

14.2mm

TO-252 (D)

TO-263 (D2)

TO-268 (D3)

±0.2mm

(continued)

170

1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com

DA-T268-301E Related Products

	DA-T268-301E	DA-T263-201E-TR
Description	Heat Sinks HEATSINK FOR TO-268	Heat Sinks HEATSINK FOR TO-263
Is it Rohs certified?	conform to	conform to
Reach Compliance Code	compliant	compliant
Heat Resistant Support Device Type	HEAT SINK	HEAT SINK

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