|
RM46L830 |
RM46L430ZWTT |
RM46L830ZWTT |
RM46L830PGET |
RM46L430PGET |
RM46L430 |
Description |
RM46L830 16/32-Bit RISC Flash Microcontroller |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash Microcntlr |
RM46L430 16- and 32-Bit RISC Flash Microcontroller |
Brand Name |
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Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
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Is it lead-free? |
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Lead free |
Lead free |
Lead free |
Lead free |
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Is it Rohs certified? |
- |
conform to |
conform to |
conform to |
conform to |
- |
Maker |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
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Parts packaging code |
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BGA |
BGA |
QFP |
QFP |
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package instruction |
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GREEN, PLASTIC, NFBGA-337 |
LFBGA, BGA337,19X19,32 |
LFQFP, QFP144,.87SQ,20 |
GREEN, PLASTIC, LQFP-144 |
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Contacts |
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337 |
337 |
144 |
144 |
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Reach Compliance Code |
- |
compliant |
compliant |
compliant |
compliant |
- |
ECCN code |
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3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
- |
Has ADC |
- |
YES |
YES |
YES |
YES |
- |
Address bus width |
- |
13 |
13 |
13 |
13 |
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bit size |
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32 |
32 |
32 |
32 |
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CPU series |
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CORTEX-R4F |
CORTEX-R4F |
CORTEX-R4F |
CORTEX-R4F |
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maximum clock frequency |
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80 MHz |
80 MHz |
80 MHz |
80 MHz |
- |
DAC channel |
- |
NO |
NO |
NO |
NO |
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DMA channel |
- |
YES |
YES |
YES |
YES |
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External data bus width |
- |
16 |
16 |
16 |
16 |
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JESD-30 code |
- |
S-PBGA-B337 |
S-PBGA-B337 |
S-PQFP-G144 |
S-PQFP-G144 |
- |
JESD-609 code |
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e1 |
e1 |
e4 |
e4 |
- |
length |
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16 mm |
16 mm |
20 mm |
20 mm |
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Humidity sensitivity level |
- |
3 |
3 |
3 |
3 |
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Number of I/O lines |
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16 |
16 |
16 |
16 |
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Number of terminals |
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337 |
337 |
144 |
144 |
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Maximum operating temperature |
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105 °C |
105 °C |
105 °C |
105 °C |
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Minimum operating temperature |
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-40 °C |
-40 °C |
-40 °C |
-40 °C |
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PWM channel |
- |
YES |
YES |
YES |
YES |
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Package body material |
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PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
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encapsulated code |
- |
LFBGA |
LFBGA |
LFQFP |
LFQFP |
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Encapsulate equivalent code |
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BGA337,19X19,32 |
BGA337,19X19,32 |
QFP144,.87SQ,20 |
QFP144,.87SQ,20 |
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Package shape |
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SQUARE |
SQUARE |
SQUARE |
SQUARE |
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Package form |
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GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
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power supply |
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1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
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Certification status |
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Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
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RAM (bytes) |
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131072 |
196608 |
196608 |
131072 |
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rom(word) |
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1048576 |
1310720 |
1310720 |
1048576 |
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ROM programmability |
- |
FLASH |
FLASH |
FLASH |
FLASH |
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Maximum seat height |
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1.4 mm |
1.4 mm |
1.6 mm |
1.6 mm |
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speed |
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200 MHz |
200 MHz |
200 MHz |
200 MHz |
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Maximum slew rate |
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400 mA |
400 mA |
400 mA |
400 mA |
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Maximum supply voltage |
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1.32 V |
1.32 V |
1.32 V |
1.32 V |
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Minimum supply voltage |
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1.14 V |
1.14 V |
1.14 V |
1.14 V |
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Nominal supply voltage |
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1.2 V |
1.2 V |
1.2 V |
1.2 V |
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surface mount |
- |
YES |
YES |
YES |
YES |
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technology |
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CMOS |
CMOS |
CMOS |
CMOS |
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Temperature level |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
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Terminal surface |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
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Terminal form |
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BALL |
BALL |
GULL WING |
GULL WING |
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Terminal pitch |
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0.8 mm |
0.8 mm |
0.5 mm |
0.5 mm |
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Terminal location |
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BOTTOM |
BOTTOM |
QUAD |
QUAD |
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width |
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16 mm |
16 mm |
20 mm |
20 mm |
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uPs/uCs/peripheral integrated circuit type |
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MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
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