|
CD4066B-MIL |
CD4066BF |
CD4066BF3A |
JM38510/05852BCA |
M38510/05852BCA |
CD4066B |
CD4066BNS |
Description |
CD4066B-MIL CMOS Quad Bilateral Switch |
CMOS Quad Bilateral Switch 14-CDIP -55 to 125 |
CMOS Quad Bilateral Switch 14-CDIP -55 to 125 |
CMOS Quad Bilateral Switch 14-CDIP -55 to 125 |
CMOS Quad Bilateral Switch 14-CDIP -55 to 125 |
CD4066B CMOS Quad Bilateral Switch |
CMOS Quad Bilateral Switch 14-SO |
Brand Name |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
Parts packaging code |
- |
DIP |
DIP |
DIP |
DIP |
- |
- |
package instruction |
- |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
DIP, |
DIP, DIP14,.3 |
- |
SOP, |
Contacts |
- |
14 |
14 |
14 |
14 |
- |
- |
Reach Compliance Code |
- |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
- |
compliant |
ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
- |
Factory Lead Time |
- |
6 weeks |
6 weeks |
1 week |
6 weeks |
- |
- |
Analog Integrated Circuits - Other Types |
- |
SPST |
SPST |
SPST |
SPST |
- |
SPST |
Nominal bandwidth |
- |
40 MHz |
40 MHz |
40 MHz |
40 MHz |
- |
40 MHz |
JESD-30 code |
- |
R-GDIP-T14 |
R-GDIP-T14 |
R-GDIP-T14 |
R-GDIP-T14 |
- |
R-PDSO-G14 |
length |
- |
19.43 mm |
19.56 mm |
19.56 mm |
19.56 mm |
- |
10.3 mm |
Nominal Negative Supply Voltage (Vsup) |
- |
-5 V |
-5 V |
-5 V |
-5 V |
- |
- |
normal position |
- |
NO |
NO |
NO |
NO |
- |
- |
Number of channels |
- |
1 |
4 |
4 |
4 |
- |
1 |
Number of functions |
- |
4 |
4 |
4 |
4 |
- |
1 |
Number of terminals |
- |
14 |
14 |
14 |
14 |
- |
14 |
Maximum on-state resistance (Ron) |
- |
1050 Ω |
1050 Ω |
1050 Ω |
600 Ω |
- |
- |
Maximum operating temperature |
- |
125 °C |
125 °C |
125 °C |
125 °C |
- |
125 °C |
Minimum operating temperature |
- |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
- |
-55 °C |
output |
- |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
- |
- |
Package body material |
- |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
- |
PLASTIC/EPOXY |
encapsulated code |
- |
DIP |
DIP |
DIP |
DIP |
- |
SOP |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
- |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
- |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Qualified |
- |
- |
Filter level |
- |
MIL-STD-883 |
38535Q/M;38534H;883B |
MIL-M-38510 Class B |
MIL-PRF-38535 Class B |
- |
- |
Maximum seat height |
- |
5.08 mm |
4.57 mm |
4.57 mm |
4.57 mm |
- |
2 mm |
Maximum signal current |
- |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
- |
- |
Maximum supply current (Isup) |
- |
0.15 mA |
0.15 mA |
0.15 mA |
0.15 mA |
- |
0.03 mA |
Maximum supply voltage (Vsup) |
- |
18 V |
18 V |
18 V |
15 V |
- |
- |
Minimum supply voltage (Vsup) |
- |
3 V |
3 V |
3 V |
4.5 V |
- |
- |
Nominal supply voltage (Vsup) |
- |
5 V |
5 V |
5 V |
5 V |
- |
- |
surface mount |
- |
NO |
NO |
NO |
NO |
- |
YES |
Maximum connection time |
- |
70 ns |
70 ns |
70 ns |
90 ns |
- |
- |
switch |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
- |
technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
- |
- |
Temperature level |
- |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
- |
MILITARY |
Terminal form |
- |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
- |
GULL WING |
Terminal pitch |
- |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
- |
1.27 mm |
Terminal location |
- |
DUAL |
DUAL |
DUAL |
DUAL |
- |
DUAL |
Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
width |
- |
7.62 mm |
6.67 mm |
6.67 mm |
6.67 mm |
- |
5.3 mm |