4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, PDIP14, PLASTIC, DIP-14
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Maker | Texas Instruments |
Parts packaging code | DIP |
package instruction | DIP-14 |
Contacts | 14 |
Reach Compliance Code | unknown |
series | 4000/14000/40000 |
JESD-30 code | R-PDIP-T14 |
length | 19.18 mm |
Logic integrated circuit type | NOR GATE |
Number of functions | 3 |
Number of entries | 3 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 250 ns |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 15 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
CD4025BMN | CD4023BMN | CD4025BCN | |
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Description | 4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, PDIP14, PLASTIC, DIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, PDIP14, PLASTIC, DIP-14 |
Is it lead-free? | Contains lead | Contains lead | Contains lead |
Maker | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | DIP | DIP | DIP |
package instruction | DIP-14 | DIP, | DIP, |
Contacts | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown |
series | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 code | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
length | 19.18 mm | 19.18 mm | 19.18 mm |
Logic integrated circuit type | NOR GATE | NAND GATE | NOR GATE |
Number of functions | 3 | 3 | 3 |
Number of entries | 3 | 3 | 3 |
Number of terminals | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 85 °C |
Minimum operating temperature | -55 °C | -55 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
propagation delay (tpd) | 250 ns | 250 ns | 250 ns |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 15 V | 15 V | 15 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | INDUSTRIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 7.62 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | 1 | - |