ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | DIP |
package instruction | DIP, DIP20,.3 |
Contacts | 20 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum analog input voltage | 4.9 V |
Minimum analog input voltage | -0.1 V |
Maximum conversion time | 2 µs |
Converter type | ADC, FLASH METHOD |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e3 |
length | 26.16 mm |
Humidity sensitivity level | 1 |
Number of analog input channels | 1 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output bit code | BINARY |
Output format | PARALLEL, 8 BITS |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Sample and hold/Track and hold | TRACK |
Maximum seat height | 4.572 mm |
Maximum slew rate | 15 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |
ADC0820BCN+ | ADC0820BCM+ | ADC0820BCM+T | |
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Description | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO20, SO-20 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO20, SO-20 |
Is it lead-free? | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to |
Parts packaging code | DIP | SOIC | SOIC |
package instruction | DIP, DIP20,.3 | SOP, | SOP, |
Contacts | 20 | 20 | 20 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum analog input voltage | 4.9 V | 4.9 V | 4.9 V |
Maximum conversion time | 2 µs | 2 µs | 2 µs |
Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 code | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609 code | e3 | e3 | e3 |
length | 26.16 mm | 12.8 mm | 12.8 mm |
Number of analog input channels | 1 | 1 | 1 |
Number of digits | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Output bit code | BINARY | BINARY | BINARY |
Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Sample and hold/Track and hold | TRACK | TRACK | TRACK |
Maximum seat height | 4.572 mm | 2.65 mm | 2.65 mm |
Maximum slew rate | 15 mA | 15 mA | 15 mA |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.5 mm | 7.5 mm |
Humidity sensitivity level | 1 | 1 | - |
Base Number Matches | 1 | 1 | - |
Maker | - | Maxim | Maxim |