IS62C256-70TI datasheet, PDF - EEWORLD Datasheet

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IS62C256-70TI: Description32K X 8 STANDARD SRAM, 70 ns, PDSO28; Categorystorage; File Size39KB，8 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/

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IS62C256-70TI Overview

32K X 8 STANDARD SRAM, 70 ns, PDSO28

IS62C256-70TI Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	28
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	4.5 V
Rated supply voltage	5 V
maximum access time	70 ns
Processing package description	Plastic, SOP-28
state	ACTIVE
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	1.27 mm
terminal coating	tin lead
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL
memory width	8
organize	32K × 8
storage density	262144 deg
operating mode	ASYNCHRONOUS
Number of digits	32768 words
Number of digits	32K
Memory IC type	Standard memory
serial parallel	parallel

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IS62C256

32K x 8 LOW POWER CMOS STATIC RAM

FEATURES

• Access time: 45, 70 ns

• Low active power: 200 mW (typical)

• Low standby power

— 250

µW

(typical) CMOS standby

— 28 mW (typical) TTL standby

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Single 5V power supply

ISSI

DESCRIPTION

The

ISSI

IS62C256 is a low power, 32,768 word by 8-bit

CMOS static RAM. It is fabricated using

ISSI

's high-

performance, low power CMOS technology.

When

is HIGH (deselected), the device assumes a standby

mode at which the power dissipation can be reduced down to

250

µW

(typical) at CMOS input levels.

Easy memory expansion is provided by using an active LOW

Chip Select (

) input and an active LOW Output Enable (

)

input. The active LOW Write Enable (

) controls both writing

and reading of the memory.

The IS62C256 is pin compatible with other 32K x 8 SRAMs in

plastic SOP or TSOP (Type I) package.

FUNCTIONAL BLOCK DIAGRAM

A0-A14

DECODER

32K X 8

MEMORY ARRAY

VCC

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CONTROL

CIRCUIT

ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which

Integrated Silicon Solution, Inc. — 1-800-379-4774

SR072-1E

05/12/99

IS62C256-70TI Related Products

	IS62C256-70TI	62C256	IS62C256-45T	IS62C256	IS62C256-45TI	IS62C256-45U	IS62C256-45UI	IS62C256-70T
Description	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28	32K X 8 STANDARD SRAM, 70 ns, PDSO28
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28
Maximum operating temperature	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel
Minimum operating temperature	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel
Maximum supply/operating voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply/operating voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Rated supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
maximum access time	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns
Processing package description	Plastic, SOP-28	Plastic, SOP-28	Plastic, SOP-28	Plastic, SOP-28	Plastic, SOP-28	Plastic, SOP-28	Plastic, SOP-28	Plastic, SOP-28
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
packaging shape	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle
Package Size	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
surface mount	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal spacing	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
terminal coating	tin lead	tin lead	tin lead	tin lead	tin lead	tin lead	tin lead	tin lead
Terminal location	pair	pair	pair	pair	pair	pair	pair	pair
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
memory width	8	8	8	8	8	8	8	8
organize	32K × 8	32K × 8	32K × 8	32K × 8	32K × 8	32K × 8	32K × 8	32K × 8
storage density	262144 deg	262144 deg	262144 deg	262144 deg	262144 deg	262144 deg	262144 deg	262144 deg
operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Memory IC type	Standard memory	Standard memory	Standard memory	Standard memory	Standard memory	Standard memory	Standard memory	Standard memory
serial parallel	parallel	parallel	parallel	parallel	parallel	parallel	parallel	parallel
Number of digits	32K	32K	32K	32K	32K	32K	32K	32K

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