|
IS61WV25616BLL-10BI |
IS61WV25616BLS-25TLI |
IS61WV25616BLS-25TLI-TR |
Description |
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 25ns, CMOS, PDSO44, LEAD FREE, PLASTIC, TSOP2-44 |
Standard SRAM, 256KX16, 25ns, CMOS, PDSO44 |
Is it Rohs certified? |
incompatible |
conform to |
conform to |
Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Reach Compliance Code |
compliant |
compliant |
compliant |
Maximum access time |
10 ns |
25 ns |
25 ns |
I/O type |
COMMON |
COMMON |
COMMON |
JESD-30 code |
R-PBGA-B48 |
R-PDSO-G44 |
R-PDSO-G44 |
memory density |
4194304 bit |
4194304 bit |
4194304 bit |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
memory width |
16 |
16 |
16 |
Number of terminals |
48 |
44 |
44 |
word count |
262144 words |
262144 words |
262144 words |
character code |
256000 |
256000 |
256000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
organize |
256KX16 |
256KX16 |
256KX16 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
TSOP2 |
TSOP |
Encapsulate equivalent code |
BGA48,6X8,30 |
TSOP44,.46,32 |
TSOP44,.46,32 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
power supply |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum standby current |
0.009 A |
0.009 A |
0.009 A |
Minimum standby current |
2 V |
2 V |
2 V |
Maximum slew rate |
0.045 mA |
0.025 mA |
0.025 mA |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
GULL WING |
GULL WING |
Terminal pitch |
0.75 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
DUAL |
DUAL |
Base Number Matches |
1 |
1 |
1 |
Is it lead-free? |
Contains lead |
Lead free |
- |
Parts packaging code |
BGA |
TSOP2 |
- |
package instruction |
TFBGA, BGA48,6X8,30 |
TSOP2, TSOP44,.46,32 |
- |
Contacts |
48 |
44 |
- |
ECCN code |
3A991.B.2.A |
3A991.B.2.A |
- |
JESD-609 code |
e0 |
e3 |
- |
length |
8 mm |
18.415 mm |
- |
Humidity sensitivity level |
3 |
3 |
- |
Number of functions |
1 |
1 |
- |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
- |
Maximum seat height |
1.2 mm |
1.2 mm |
- |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
- |
Minimum supply voltage (Vsup) |
2.4 V |
2.4 V |
- |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
- |
Terminal surface |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) - annealed |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
10 |
- |
width |
6 mm |
10.16 mm |
- |
Factory Lead Time |
- |
8 weeks |
8 weeks |
Is Samacsys |
- |
N |
N |