EE PLD, 20ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | DIP |
package instruction | CERAMIC, DIP-24 |
Contacts | 24 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Other features | 1 EXTERNAL CLOCK; REGISTER PRELOAD |
Architecture | PAL-TYPE |
maximum clock frequency | 31.2 MHz |
JESD-30 code | R-GDIP-T24 |
JESD-609 code | e0 |
length | 31.877 mm |
Humidity sensitivity level | 1 |
Dedicated input times | 11 |
Number of I/O lines | 10 |
Number of entries | 22 |
Output times | 10 |
Number of product terms | 132 |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 11 DEDICATED INPUTS, 10 I/O |
Output function | MACROCELL |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programmable logic type | EE PLD |
propagation delay | 20 ns |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.08 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |