Pin Description and Physical Orientation...................................................................................................................................8
Power - Estimated.......................................................................................................................................................................9
Test Definitions .............................................................................................................................................................................16
Test Regions of Interest ............................................................................................................................................................16
Test Sub Regions of Interest.....................................................................................................................................................16
Maximum Ratings .....................................................................................................................................................................19
Maximum Voltage Ratings Between Pins ................................................................................................................................19
DC Bias Operating Conditions ..................................................................................................................................................20
AC Operating Conditions...........................................................................................................................................................21
Clock Line Capacitances .......................................................................................................................................................21
One Output Full Field ............................................................................................................................................................28
Two Outputs Full Field ..........................................................................................................................................................29
One Output Center Columns.................................................................................................................................................30
Two Outputs Center Columns...............................................................................................................................................31
One Output Center Rows.......................................................................................................................................................32
Two Outputs Center Rows.....................................................................................................................................................33
One Output Center Rows and Columns................................................................................................................................34
Two Outputs Center Rows and Columns..............................................................................................................................35
Vertical Clocks Phases 1 and 2 – Line Timing Detail...........................................................................................................39
Electronic Shutter – Integration Time Definition .................................................................................................................44
Fast Line Dump Timing .........................................................................................................................................................45
Example HCCD Clock Driver.....................................................................................................................................................46
Single Output Only.................................................................................................................................................................46
Selectable Single or Dual Output..........................................................................................................................................46
Storage and Handling ...................................................................................................................................................................47
Die to Package Alignment.........................................................................................................................................................49
Quality Assurance and Reliability.................................................................................................................................................53
Ordering Information ....................................................................................................................................................................54
Figure 3: Power ...............................................................................................................................................................................9
Figure 5: Monochrome with Microlens Quantum Efficiency .......................................................................................................14
Figure 6: Color with Microlens Quantum Efficiency ....................................................................................................................14
Figure 9: Test Sub Regions of Interest.........................................................................................................................................16
Figure 10: Overclock Regions of Interest.....................................................................................................................................16
Figure 18: Integration Time Definition .........................................................................................................................................44
Figure 19: Fast Line Dump Timing...............................................................................................................................................45
Figure 21: Die to Package Alignment...........................................................................................................................................49
Heart rate detection BLE device based on RSL10
Author: yilonglucky
1. Introduction
Heart rate detection service is a standard sub-protocol in the Bluetooth protocol family. This project is based on RS...
yilongluckyonsemi and Avnet IoT Innovation Design Competition
[size=4] The msp430 is used as the data processing chip, and the Hall sensor is used to collect the time T for the wheel to rotate one circle. Therefore, according to C/T, the speed of the car can be ...
The analog small signal is amplified by the amplifier and directly connected to the SAR ADC without RC filtering in between.
When testing a signal, if the amplitude of the signal is large, the collect...
Since the late 1990s and early 2000s, many batteries and battery packs that were intended for use in ITE products have been recalled, and this situation is still continuing. A few years ago, the Infor...
"Principles and Analysis of High Frequency Circuits" is a revised version of "Principles and Analysis of High Frequency Circuits (Second Edition)". The revised book has 9 chapters, including introduct...
I saw that the moderator had ported it to F103. Is it possible to port it to non-STM series chips?
Does the chip that needs to be ported have any requirements for architecture, ROM, etc.?Is there any ...
On May 30, the "Secrip 20GWh Power Battery System Project", an important supporting project for the implementation of China Wuling's "two million, five billion" new energy strategy, officially brok...[Details]
Recently, Samsung pushed an update for the 6-year-old Galaxy Tab S 8.4. Samsung launched the Galaxy Tab S 8.4 in 2014 as the first model in the Galaxy Tab S flagship tablet series. The tablet comes...[Details]
An inverter is a device that converts DC power (battery, storage battery) into AC power (usually 220V 50HZ sine wave or square wave). Our common emergency power supply usually converts DC battery int...[Details]
September 20, 2024, Tessenderlo, Belgium -
Melexis, a global microelectronics engineering company, announces the addition of the MLX92253 to its Hall-effect dual latch product family.
This
...[Details]
Medical appliance
OEMs
are developing more technologically advanced personal healthcare devices for treating and monitoring common diseases. These products are affordable and greatly improve...[Details]
Introduction
Terminal systems such as advanced telecommunications and wireless architectures, network and communication technologies, and high-speed service platforms require continuous ...[Details]
Recently, we obtained a video recording the actual measurement results of Ideal MEGA ( parameters | inquiry ) super charging. The video shows the advantages of Ideal MEGA super charging from many d...[Details]
I. Overview
The S3C6410 interrupt controller consists of two VICs (Vectored Interrupt Controller, ARM PrimeCell) and two TZIC's (TrustZone Interrupt Controller SP890).
The two TZIC's and VIC's are ...[Details]
A simple automatic shutdown circuit is installed on the DT-830 digital multimeter. The device is small in size, simple in structure, and does not require debugging. In principle, it can be suitable f...[Details]
The mini2440 is connected to a resistive touch screen, which is based on AD conversion. That is, when a certain position is pressed, the voltage at that point will change. The voltage can be used to ...[Details]
1 Analog interface
Analog and digital video sources have been around for a long time, with analog video being common in desktops and digital video being more popular in laptops. A large number...[Details]
At the 7th Shanghai FD-SOI Forum held on September 16, 2019, Zeng Yi, director of VeriSilicon's IoT interconnection platform, pointed out that with the development of the IoT industry, the equipment ...[Details]
"Whether it is AI or the Internet, the underlying support is inseparable from semiconductor technology." Dr. Wang Rui, senior vice president of Intel Corporation and chairman of Intel China, said rec...[Details]
In recent years, with the rapid development of integrated circuit technology, especially the rapid development of programmable logic devices, EDA (Electronic Design Automation) technology has becom...[Details]