|
2SK762A |
2SK762 |
Description |
Silicon N-channel Power F-MOS FET |
Silicon N-channel Power F-MOS FET |
Is it Rohs certified? |
incompatible |
incompatible |
Parts packaging code |
TO-220AB |
TO-220AB |
package instruction |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
Contacts |
3 |
3 |
Reach Compliance Code |
unknow |
unknow |
Shell connection |
ISOLATED |
ISOLATED |
Configuration |
SINGLE |
SINGLE |
Minimum drain-source breakdown voltage |
450 V |
400 V |
Maximum drain current (Abs) (ID) |
3 A |
3 A |
Maximum drain current (ID) |
3 A |
3 A |
Maximum drain-source on-resistance |
3 Ω |
3 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code |
TO-220AB |
TO-220AB |
JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
JESD-609 code |
e0 |
e0 |
Number of components |
1 |
1 |
Number of terminals |
3 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
FLANGE MOUNT |
FLANGE MOUNT |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
Maximum power dissipation(Abs) |
40 W |
2 W |
Maximum pulsed drain current (IDM) |
6 A |
6 A |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
NO |
NO |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal location |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
Base Number Matches |
1 |
1 |