hochtemperaturbeständig, Liefermöglichkeiten auf Anfrage
Standard /
Standard
Mounting Type
/
Befestigungsarten
W
T
Z
Float mounted (see page 15)
/
Schwimmend (siehe Seite15)
Clinch nut 4-40 UNC (see page 59)
/
Einnietmutter 4-40 UNC (siehe Seite 59)
Clinch nut M3 (see page 59)
/
Einnietmutter M3 (siehe Seite 59)
Einnietmutter 4-40 UNC, selbstsichernd (siehe Seite 59)
Einnietmutter M3, selbstsichernd (siehe Seite 59)
TS
Clinch nut 4-40 UNC, self locking (see page 59)
ZS
Clinch nut M3, self locking (see page 59)
No. of Contacts /
Polzahl
Shell size /
Gehäusegröße
09
1
15
2
25
3
37
4
50
5
Contact Type /
Kontaktart
P
Pin contacts /
Stiftkontakte
S
Socket contacts /
Buchsenkontakte
Contact Design (e. g.)
/
Kontaktvariante (z. B.)
0
1
4
5
14
Solder pot
/
Löttopf
Straight PCB termination /
Leiterplattenanschluss, gerade
Wire-wrap /
Wire Wrap
Right angled PCB termination /
Leiterplattenanschluss, abgewinkelt
Straight PCB termination
/
Leiterplattenanschluss, gerade
For more contacts see page 16 onwards
/
Weitere Kontakte siehe Seite 16 ff.
Machined contacts /
Gedrehte Kontakte
S
Stamped contacts
/
Gestanzte Kontakte
Direction of Right Angled Contacts
/
Richtung der abgewinkelten Kontakte
Standard /
Standard
R
Reverse (Not available with stamped contacts)
/
Revers (nicht mit gestanzten Kontakten möglich)
Performance Classes Available in Accordance with DIN 41652
/
Lieferbare Gütestufen nach DIN 41652
Standard insulator /
Standardisolierkörper
G1
= 500 Contact cycles
/
Steckzyklen
= Performance class 1
/
Gütestufe 1
G2
= 200 Contact cycles
/
Steckzyklen
= Performance class 2
/
Gütestufe 2
G3
= 50 Contact cycles
/
Steckzyklen
= Performance class 3
/
Gütestufe 3
Pin connector with dimples
/
Stiftsteckverbinder mit Kontaktnoppen
FM insulator /
FM-Isolierkörper
All connectors are in accordance with the standards of performance class 1; no performance class
number necessary! (1.3 µm (51 microinches) Au over Ni)
Alle Steckverbinder erfüllen die Anforderungen der Gütestufe 1; Typenbezeichnung ohne Gütestufen!
(1,3 µm Au über Ni)
Modifications
/
Modifikationen
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
DS 10/2007
9
Technical Data
Technische Daten
Mechanical Data
Mechanische Daten
Mechanical Data
Mechanische Daten
Mating force per signal contact
Steckkraft pro Signalkontakt
Unmating force per signal contact
Ziehkraft pro Signalkontakt
max. torque *
max. Anzugsmoment *
* Not for locking screws
* Nicht für Verriegelungsschrauben
3,4 N
0,2 N
40 Ncm (0,295 ft.lb.)
40 Ncm
Electrical Data
Elektrische Daten
Electrical Data
Elektrische Daten
Current rating at room temperature
Maximale Stromstärke bei Raumtemperatur
Test voltage between 2 contacts / shell and contact
Prüfspannung zwischen 2 Kontakten bzw. Kontakt und Gehäuse
Meets transition resistance requirements per contact pair in line with DIN 41652:
Erfüllt Übergangswiderstand pro Kontaktpaar nach DIN 41652 für:
- Straight contacts
/
gerade Kontakte
- Right angled contacts
/
abgewinkelte Kontakte
- Right angled contacts - 50 way
/
abgewinkelte Kontakte bei 50 Polen
Insulation resistance between contacts
Isolationswiderstand Kontakt / Kontakt
Volume resistivity
Spezifischer Durchgangswiderstand
Dielectric strength
Spezifische Durchschlagsfestigkeit
5A
1200 V / 1 min.
10 m
25 m
35 m
5000 M
10
16
cm
50 kV / mm
Materials and Platings
Materialien und Oberflächen
Materials and Platings
Materialien und Oberflächen
Shell
Gehäuse
Type /
Type
Insulator
Isolierkörper
Steel
Stahl
FH
Polyester, heat resistant,
glass filled (UL94V-0), natural
Polyester,
hochtemperaturbeständig,
glasfaserverstärkt (UL94V-0), natur
150 °C (302 °F)
F
Polyester, glass filled
(UL94V-0), white
Polyester, glasfaserverstärkt
(UL94V-0), weiß
FM
Polyester, glass filled (UL94V-0),
green
Polyester, glasfaserverstärkt
(UL94V-0), grün
Relative temperature index according
to UL 746 B
rel.
Temperaturindex nach
UL 746 B
Heat deflection temperature limit
according to DIN 53461 HDT/A
Formbeständigkeitstemperatur nach
DIN 53461 HDT/A
Sub temperature limit
Untere Grenztemperatur
Shell plating (standard)
Gehäuseoberfläche (Standard)
Shell (standard)
Gehäuse (Standard)
Shell (K120)
Gehäuse (K120)
125 °C (257 °F)
130 °C (266 °F)
200 °C (392 °F)
255 °C ( 491 °F)
210 °C (410 °F)
-55 °C (-67 °F)
Tin plated over nickel
verzinnt über Nickel
-55 °C (-67 °F)
-55 °C (-67 °F)
Yellow chromate over zinc plating
Not RoHS compliant
verzinkt und gelb chromatiert
nicht RoHS konform
Pin connector shell without dimples
Stiftsteckverbindergehäuse ohne
Kontaktnoppen
Tin plated over nickel, pin connector
shell
with
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
mit
Kontaktnoppen
Tin plated over nickel, pin connector
shell
without
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
ohne
Kontaktnoppen
Pin connector shell with dimples
Stiftsteckverbindergehäuse mit Kontaktnoppen
Shell (K121)
Gehäuse (K121)
Contact material
Kontaktmaterial
Copper alloy
Kupfer-Legierung
10
DS 10/2007
TECHNISCHE ÄNDERUNGEN VORBEHALTEN – MAßE IN MILLIMETER (INCHES IN KLAMMERN)
Technical Data
Technische Daten
Modifications
Modifikationen
All FCT D-Sub connectors (including crimp versions etc.) are available in many different combinations of materials and platings. For example, shells can
be supplied in a non – magnetic version made of brass, which can be electroless nickel, or gold plated for use in aerospace technology.
Alle FCT D-Sub Steckverbinder (auch Crimp Versionen, usw.) sind in vielen verschiedenen Material- und Oberflächenkombinationen erhältlich. So z. B.
Gehäuse in nichtmagnetischer Ausführung aus Messing bzw. chemisch vernickelte oder vergoldete Gehäuse für Luft- und Raumfahrtanwendungen.
Contact Arrangements
Polbilder
Face view of socket connector
Blick auf Steckseite Buchsensteckverbinder
Face view of pin connector
Blick auf Steckseite Stiftsteckverbinder
Shell Size
Gehäusegröße
Number of Contacts
Polzahl
Pin Connector, Connecting Side
Stiftsteckverbinder, Ansicht steckseitig
1
9
2
15
3
25
4
37
5
50
DS 10/2007
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
This circuit uses two inductive water level sensors (model SW08) as the core to build a water level control system.The SW08 water level sensor is an external water level sensor. It is directly attache...
TI has recently released some of its reference designs in the fields of industry, automobiles, and personal electronics. The content is very detailed. Netizens who are working on related content proje...
IoT Moment: The True Definition of IoT : https://training.eeworld.com.cn/course/5080Want a quick minute? Our new video series "IoT Minute" features Qorvo General Manager Cees Links, who helps provide ...
[i=s]This post was last edited by faraway_99 on 2019-3-16 23:18[/i] As shown in the figure below, it is necessary to refer to the zero crossing point of Iab to control the output of Vg1 and Vg2 PWM wa...
Zynq UltraScale+MPSOC development boardBased on Mir Electronics MYC-CZU3EG core board and development board
The Xilinx Zynq UltraScale+ MPSoC series integrates a feature-rich 64-bit quad-core Arm Cort...
At 3 p.m. on February 2, at the construction site of Leishenshan Hospital, excavators waved their mechanical arms up and down, vehicles transporting equipment shuttled back and forth, and workers w...[Details]
On April 17, the world's largest 5MW supercapacitor energy storage system completed grid dispatching and joint commissioning at Huaneng Luoyuan Power Plant. All adjustment indicators met grid requirem...[Details]
As shown in the figure, this is a light-off reminder circuit. The circuit consists of a monostable delay circuit, a drive circuit, a buzzer, a light-emitting diode, etc. The output signal of the mo...[Details]
At present, under the development trend of intelligent networking in the automotive industry, in-vehicle intelligent systems have become standard equipment for almost all models. McKinsey predicts...[Details]
The general service life of a car battery is 2 years, and if it is well maintained, it can be used for more than 3 years. The length of the service life of a car battery is not only related to the ...[Details]
1. Measurement of voltage 1. Measurement of DC voltage, such as batteries, walkman power supplies, etc. First, insert the black test lead into the "com" hole and the red test lead into the "V Ω" hole...[Details]
A few days ago, a statistical chart about domestic birth population trends went viral on social media platforms. Behind this is the reality that my country’s birth population is decreasing year by ye...[Details]
Earlier we used assembly to complete a running light experiment: Tiny4412 assembly running light code, Tiny4412 bare metal LED operation However, assembly language is not very readable, so in this ...[Details]
Jiwei.com reported on May 27 that the smartphone brand Redmi held the "Note10 flagship chip Little King Kong" conference. At the opening of the conference, Lu Weibing, president of Xiaomi China and I...[Details]
Comparison table of commonly used Chinese and English abbreviations in circuit diagrams
a analog
ab address bus
accessorier accessories
adc analog to digital conversion
...[Details]
Abstract: In order to measure the temperature, pressure, flow and other thermal parameters of each part of the large-scale double-tower 4-effect high-temperature multi-effect seawater desalination ex...[Details]
Preface
In a closed-loop drilling system, it is required to transmit the information from the wellbore to the surface in real time for manual monitoring. Usually, this task is completed by...[Details]
Some time ago, I recommended MIFANS Pi T527 to you. It is a high-performance T527 development board launched by Mir Electronics.
Today I would like to recommend to you the brother of M...[Details]
It is well known that functional verification takes up the most time in the entire chip design cycle. Although there are many technologies available to reduce verification time, how should we choose? ...[Details]
Linear Technology Corporation has launched the LT3475 , a dual-output 36V , up to 2MHz step-down DC/DC converter designed to operate as a dual-channel constant current LED driver. Each c...[Details]