PN7362AUEV/C300E datasheet, PDF

PN7362AUEV/C300E: DescriptionRISC Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，108 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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PN7362AUEV/C300E Overview

RISC Microcontroller

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	VFBGA,
Reach Compliance Code	compliant
Has ADC	NO
Other features	ALSO HAVING 40 KBYTE BOOT ROM
Address bus width
bit size	32
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PBGA-B64
length	4.5 mm
Humidity sensitivity level	3
Number of I/O lines	21
Number of terminals	64
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
RAM (bytes)	12288
rom(word)	163840
ROM programmability	FLASH
Maximum seat height	0.9 mm
speed	20 MHz
Maximum supply voltage	1.95 V
Minimum supply voltage	1.65 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

	PN7362AUEV/C300E	PN7462AUEV/C300E	PN7462AUEV/C300Y	PN7362AUEV/C300Y
Description	RISC Microcontroller	RISC Microcontroller	RISC Microcontroller	RISC Microcontroller
Is it Rohs certified?	conform to	conform to	conform to	conform to
package instruction	VFBGA,	VFBGA,	VFBGA,	VFBGA-64
Reach Compliance Code	compliant	compliant	compliant	compliant
Has ADC	NO	YES	YES	NO
bit size	32	32	32	32
DMA channel	NO	NO	NO	NO
length	4.5 mm	4.5 mm	4.5 mm	4.5 mm
Number of I/O lines	21	21	21	21
Number of terminals	64	64	64	64
PWM channel	NO	NO	NO	NO
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
speed	20 MHz	20 MHz	20 MHz	20 MHz
Maximum supply voltage	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.8 mm	0.8 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	4.5 mm	4.5 mm	4.5 mm	4.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	1	1	1	1
Maker	-	NXP	NXP	NXP

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