5962-9561312HYC datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9561312HYC

5962-9561312HYC: DescriptionStandard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32; Categorystorage storage; File Size136KB，17 Pages; ManufacturerMicross; Websitehttps://www.micross.com

Download Datasheet Parametric View All

5962-9561312HYC Overview

Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

5962-9561312HYC Parametric

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	DIP
package instruction	DIP, DIP32,.6
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	35 ns
I/O type	COMMON
JESD-30 code	R-CDIP-T32
JESD-609 code	e4
length	41.525 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	7.493 mm
Maximum standby current	0.01 A
Minimum standby current	2 V
Maximum slew rate	0.2 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

Preview

Download Datasheet

View All

SRAM

AS5C4008

512K x 8 SRAM

SRAM MEMORY ARRAY

AVAILABLE AS MILITARY

SPECIFICATION

• SMD 5962-95600

• SMD 5962-95613

• MIL STD-883

PIN ASSIGNMENT

(Top View)

32-Pin DIP (CW), 32-Pin LCC (EC)

32-Pin SOJ (ECJ)

A18

A16

A14

A12

I/O0

I/O1

I/O2

Vss

Vcc

A15

A17

WE\

A13

A11

OE\

A10

CE\

I/O7

I/O6

I/O5

I/O4

I/O3

FEATURES

•

High Speed: 12, 15, 17, 20, 25, 35 and 45ns

High-performance, low power military grade device

Single +5V ±10% power supply

Easy memory expansion with CE\ and OE\ options

All inputs and outputs are TTL-compatible

Ease of upgradability from 1 Meg using the 32 pin

evolutionary version.

OPTIONS

•

Timing

12ns access

15ns access

17ns access

20ns access

25ns access

35ns access

45ns access

•

Operating Temperature Range

Military: -55

C to +125

Industrial: -40

C to +85

•

Packages

Ceramic Dip (600 mil)

Ceramic Flatpack

Ceramic LCC

Ceramic SOJ

• Options

2V data retention/ low power

MARKING

-12

-15

-17

-20

-25

-35

-45

ECJ

No. 112

No. 304

No. 209

No. 502

32-Pin Flat Pack (F)

A18

A16

A14

A12

I/O0

I/O1

I/O2

Vss

Vcc

A15

A17

WE\

A13

A11

OE\

A10

CE\

I/O7

I/O6

I/O5

I/O4

I/O3

NOTE:

Not all combinations of operating temperature, speed, data retention and

low power are necessarily available. Please contact factory for availability of speciﬁc

part number combinations.

GENERAL DESCRIPTION

The AS5C4008 is a 4 megabit monolithic CMOS SRAM, orga-

nized as a 512K x 8.

The evolutionary 32 pin device allows for easy upgrades from

the 1 meg SRAM.

For ﬂexibility in high-speed memory applications, Micross of-

fers chip enable (CE\) and output enable (OE\) capabilities. These

enhancements can place the outputs in High-Z for additional ﬂexibility

in system design.

Writing to these devices is accomplished when write enable

(WE\) and CE\ inputs are both LOW. Reading is accomplished when

WE\ remains HIGH and CE\ and OE\ go LOW. This allows systems

designers to meet low standby power requirements.

All devices operate from a single +5V power supply and all inputs

are fully TTL-Compatible.

AS5C4008

Rev. 6.4 01/10

For more products and information

please visit our web site at

www.micross.com

Micross Components reserves the right to change products or speciﬁcations without notice.

Recommended Resources

High input impedance three op amp differential amplifier circuit diagram

JDW91-10 type external positioning punching machine electrical box panel wiring diagram

7800 series 5A voltage regulator composed of transistors

Soil moisture upper and lower limit alarm

Agricultural equipment anti-theft alarm transmitting circuit

Asymmetric square wave circuit

2021 Annual Review - The Top Ten Development Boards with the Most Sharp Price Increases This Year (Best Financial Products of the Year): Source: Core Board10th place: Nano Pi R2S 185 yuan — 295 yuan, an increase of 159%It is extremely popular and has made great achievements in the field of soft routers . It used to be one of the most c...; 赵玉田 Talking

[GD32L233C-START Review] Running water lamp demo: [i=s]This post was last edited by YangTwo on 2022-2-25 12:27[/i]The previous review mainly focused on the organization of the board’s own resources and related development resources. This time, I bega...; YangTwo GD32 MCU

Disassembling a ROG: Last night I searched for laptop disassembly, but I didn't find any detailed disassembly pictures. The main reason was that other less expensive chips were not listed, only the more expensive chips we...; xutong Making friends through disassembly

Summary of the test of the smart car based on the DFRobot four-way motor driver board: [i=s]This post was last edited by hujj on 2019-10-29 13:01[/i]The board for this review was obtained from the EEWorld event and provided by DFRobot. Product link: http://www.dfrobot.com.cn/goods-1317....; hujj Motor Drive Control（Motor Control）

What is the use of the PACK files added after KEIL is installed, and how is it implemented?: What is the use of the PACK files added after KEIL is installed, and how is it implemented?...; 一沙一世 MCU

[GD32F310 Review] The board has not yet arrived, so we will distribute it first: Motor drive resource planning According to the previous plan, it should be ensured that the chip has the ability to drive a three-phase bridge and determine the IO allocation of the chip. The chip sig...; javnson GD32 MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components