TQFP-128, Reel
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | TQFP |
| package instruction | QFP, QFP128,.63X.87,20 |
| Contacts | 128 |
| Manufacturer packaging code | PKG128 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.B |
| Samacsys Description | TQFP 14.0 X 20.0 X 1.4 MM |
| Maximum access time | 7.5 ns |
| Maximum clock frequency (fCLK) | 83 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PQFP-G128 |
| JESD-609 code | e3 |
| memory density | 524288 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of ports | 2 |
| Number of terminals | 128 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP128,.63X.87,20 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.015 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.335 mA |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
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