MN101C61D, MN101C61G
Type
ROM (× 8-bit)
×
RAM (× 8-bit)
×
Package
Minimum Instruction
Execution Time
Standard:
MN101C61D (under development)
64 K
3K
TQFP080-P-1212D
*Lead-free
0.1
µs
(at 2.5 V to 3.6 V, 20 MHz)
0.2
µs
(at 2.1 V to 3.6 V, 10 MHz)
0.5
µs
(at 1.8 V to 3.6 V, 4 MHz)*
125
µs
(at 1.8 V to 3.6 V, 32 kHz)*
Double speed: 0.1
µs
(at 2.5 V to 3.6 V, 10 MHz)
0.2
µs
(at 2.1 V to 3.6 V, 5 MHz)
0.5
µs
(at 1.8 V to 3.6 V, 2 MHz)*
62.5
µs
(at 1.8 V to 3.6 V, 32 kHz)*
* The operation guarantee range for flash memory built-in type is 2.2V to 3.0 V or 2.7V to 3.6 V.
• RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • External 5
• Timer 0 • Timer 1 • Timer 2 • Timer 3 • Timer 4 • Timer 5 • Timer 6 • Time base
• Serial 0 reception • Serial 0 transmission • Serial 1 reception • Serial 1 transmission • Serial 2 • Serial 3
• Automatic transfer finish • A/D conversion finish • Timer 7 (2 systems) • Key interrupts (8 lines)
Timer counter 0 : 8-bit
×
1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, pulse width measurement)
Clock source ····················· 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation
clock frequency; 1/1 of XI oscillation clock frequency; external clock input
Interrupt source ················ coincidence with compare register 0
Timer counter 1 : 8-bit
×
1 (square-wave output, event count, synchronous output event)
Clock source ····················· 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation
clock frequency; 1/1 of XI oscillation clock frequency; external clock input
Interrupt source ················ coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit
×
1
(square-wave/8-bit PWM output, event count, synchronous output event, pulse width measurement)
Clock source ····················· 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation
clock frequency; 1/1 of XI oscillation clock frequency; external clock input
Interrupt source ················ coincidence with compare register 2
Timer counter 3 : 8-bit
×
1 (square-wave output, event count, generation of remote control carrier)
Clock source ····················· 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation
clock frequency; 1/1 of XI oscillation clock frequency; external clock input
Interrupt source ················ coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 4 : 8-bit
×
1
(square-wave/8-bit PWM output, event count, pulse width measurement, serial 1 baud rate timer)
Clock source ····················· 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation
clock frequency; 1/1 of XI oscillation clock frequency;
1/1 of external clock input frequency
Interrupt source ················ coincidence with compare register 4
Timer counter 5 : 8-bit
×
1
(square-wave/8-bit PWM output, event count, pulse width measurement, serial 0 baud rate timer)
Clock source ······················ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock
frequency; 1/1 of XI oscillation clock frequency;
1/1 of external clock input frequency
Interrupt source ·················· coincidence with compare register 5
MAD00009EEM
MN101C61G
128 K
12 K
Interrupts
Timer Counter
MN101C61D, MN101C61G
Timer Counter (Continue)
Timer counter 6 : 8-bit freerun timer
Clock source ····················· 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock
frequency; 1/1, 1/4096, 1/8192 of XI oscillation clock frequency
Interrupt source ················ coincidence with compare register 6
Timer counter 7 : 16-bit
×
1
(square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse
width measurement, input capture)
Clock source ····················· 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC
oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ················ coincidence with compare register 7 (2 lines)
Time base timer (one-minute count setting)
Clock source ····················· 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ················ 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency
Watchdog timer
Interrupt source ················ 1/65536, 1/262144, 1/1048576 of system clock frequency
DMA controller (automatic data transfer)
Max. Transfer cycles ········ 255
Starting factor ··················· external request, various types of interrupt, software
Transfer mode ··················· 1-byte transfer, word transfer, burst transfer
Serial Interface
Serial 0 : synchronous type / UART (full-duplex)
×
1
Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 5;
1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency
Serial 1 : synchronous type / UART (full-duplex)
×
1
Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 4;
1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency
Serial 2 : synchronous type
×
1
Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 3;
1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency
Serial 3 : synchronous type/single-master I
2
C
×
1
Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 3;
1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency
I/O Pins
A/D Inputs
Special Ports
I/O
Input
62
6
• Common use • Specified pull-up resistor available • Input/output selectable (bit unit)
• Common use • Specified pull-up resistor available
10-Bit
×
6-ch. (with S/H)
Buzzer output, remote control carrier signal output, high-current drive port
See the next page for electrical characteristics, pin assignment and support tool.
MAD00009EEM
Electrical Characteristics
Supply current
Limit
Parameter
Symbol
IDD1
Operating supply current
IDD2
IDD3
IDD4
Supply current at HALT
IDD5
IDD6
Supply current at STOP
IDD7
VDD = 3 V
20
fx = 32.768 kHz, VDD = 3 V
VDD = 3 V, Ta = 25°C
30
2
Condition
min
fosc = 20 MHz, VDD = 3 V, (fs = fosc/2)
fosc = 8.39 MHz, VDD = 3 V, (fs = fosc/2)
fx = 32.768 kHz, VDD = 3 V, (fs = fx/2)
fx = 32.768 kHz, VDD = 3 V, Ta = 25°C
4
typ
5
2
max
12
5
40
8
mA
mA
µ
A
µ
A
µ
A
µ
A
µ
A
Unit
Ta =
−40°C
to +85°C, VDD = 1.8 V to 3.6 V, VSS = 0 V
Note) Ta =
−
20°C to +70° C for a flash memory built-in version. Supply voltage range ans supply current
ratings are also different from the values mentioned above. Refer to Chapter 18 “Flash EEPROM” for
detailes
P40/TXD0/SBO0/KEY0
Pin Assignment
P41/RXD0/SBI0/KEY1
P43/TCIO5/KEY3
P42/SBT0/KEY2
P47/KEY7/A15
P46/KEY6/A14
P52/IRQ5/NCS
P45/KEY5/A9
P44/KEY4/A8
P50/NWE
P37/TCIO4/NDKDMA
43
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
42
P64/A4
P65/A5
P66/A6
P67/A7
P70/SDO0
P71/SDO1
P72/A10/SDO2
P73/A11/SDO3
P74/A12/SDO4
P75/A13/SDO5
P76/SDO6
P77/SDO7
P87/LED7,D7
P86/LED6,D6
P85/LED5,D5
P84/LED4,D4
P83/LED3,D3
P82/LED2,D2
P81/LED1,D1
P80/LED0,D0
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
10
11
12
13
14
15
16
17
18
19
20
41
P35/NLDDMA
P36/NSTDMA
P51/NRE
P54/A17
P53/A16
P63/A3
P62/A2
P61/A1
P60/A0
40
39
38
37
36
35
34
33
NBT/P34
NBR/P33
SBT3/P32
SYSCLK/SBI3/P31
SBO3/P30
IRQ4/P24
IRQ3/P23
IRQ2/P22
ACZ/IRQ1/P21
IRQ0/P20
TCIO7/P14
TCIO3/P13
TCIO2/P12
TCIO1/P11
RMOUT/TCIO0/P10
NRST/P27
NDK/BUZZER/P06
SBT2/P05
SBI2/P04
SBO2/P03
MN101C61D
MN101C61G
32
31
30
29
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
AN0/PA0
AN1/PA1
AN2/PA2
AN3/PA3
AN4/PA4
AN5/PA5
OUTC
NC
9
VREF+
VSS
XI
TXD1/SBO1/P00
VREF-
VDD
OSC2
OSC1
XO
MMOD
RXD1/SBI1/P01
TQFP080-P-1212D
*Lead-free
NC serves as the VPP pin in the MN101CF61G, and cannot be used as a user pin.
SBT1/P02
MAD00009EEM
MN101C61D, MN101C61G
Support Tool
In-circuit Emulator
Flash Memory Built-in Type
PX-ICE101C / D + PX-PRB101C61-TQFP080-P-1212-M
Type
ROM (× 8-bit)
RAM (× 8-bit)
Minimum instruction execution time
MN101CF61G
128 K
12 K
0.1
µs
(at 2.7 V to 3.6 V, 20 MHz)
0.2
µs
(at 2.7 V to 3.6 V, 10 MHz)
0.5
µs
(at 2.7 V to 3.6 V, 4 MHz)
125
µs
(at 2.7 V to 3.6 V, 32 kHz)
Package
Type
ROM (× 8-bit)
RAM (× 8-bit)
Minimum instruction execution time
TQFP080-P-1212D
*Lead-free
MN101CF60G
128 K
12 K
0.1
µs
(at 2.5 V to 3.0 V, 20 MHz)
0.2
µs
(at 2.2 V to 3.0 V, 10 MHz)
0.5
µs
(at 2.2 V to 3.0 V, 4 MHz)
125
µs
(at 2.2 V to 3.0 V, 32 kHz)
Package
TQFP080-P-1212D
*Lead-free
MAD00009EEM
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic
equipment (such as office equipment, communications equipment, measuring instruments and household
appliances).
Consult our sales staff in advance for information on the following applications:
•
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion
equipment, life support systems and safety devices) in which exceptional quality and reliability are re-
quired, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
•
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications
satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating,
the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be
liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physi-
cal injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
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2003 SEP