1N5954CUR-1E3 datasheet, PDF - EEWORLD Datasheet

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1N5954CUR-1E3: DescriptionZener Diode; CategoryDiscrete semiconductor diode; File Size293KB，5 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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1N5954CUR-1E3 Overview

Zener Diode

1N5954CUR-1E3 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	O-LELF-R2
Reach Compliance Code	compli
ECCN code	EAR99
Other features	METALLURGICALLY BONDED, HIGH RELIABILITY
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JEDEC-95 code	DO-213AB
JESD-30 code	O-LELF-R2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	1.25 W
Nominal reference voltage	160 V
surface mount	YES
technology	ZENER
Terminal surface	Matte Tin (Sn)
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	2%
Working test current	2.3 mA
Base Number Matches	1

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1N5913BUR-1 – 1N5956BUR-1

(aka CDLL5913 – CDLL5956)

Available

Metallurgically Bonded Glass Surface Mount

1.5 Watt Zener Diodes

DESCRIPTION

Screening in

reference to

MIL-PRF-19500

available

This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar

in electrical features to the JEDEC registered 1N5913B through 1N5956B axial-leaded

package for 3.3 to 200 V. It is an ideal selection for applications of high density and low

parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced

internal contacts, it may also be used for high reliability applications when required by a source

control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in

Features below.

Important:

For the latest information, visit our website

http://www.microsemi.com.

DO-213AB MELF

Package

Also available in:

DO-41 package

(glass axial-leaded)

1N5913BG – 1N5956BG

FEATURES

•

Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.

Zener voltage available 3.3 V to 200 V.

Voltage tolerances of 10%, 5%, 2% and 1% are available.

Screening in reference to MIL-PRF-19500 is available.

(See

part nomenclature

for all available options.)

RoHS compliant versions are available.

SMB package

(tabbed surface mount)

SMBG(J)5913B –

SMBG(J)5956B

SMAJ package

APPLICATIONS / BENEFITS

•

Regulates voltage over a broad ranges of operation current and temperature.

Leadless package ideal for high-density surface mounting.

Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.

Hermetically sealed glass package.

Non-sensitive to ESD per MIL-STD-750 method 1020.

Specified capacitance (see

figure 2).

Inherently radiation hard as described in Microsemi

MicroNote 050.

(tabbed surface mount)

SMAJ5913B –

SMAJ5956B

Powermite package

(tabbed surface mount)

1PMT5913B –

1PMT5956B

MAXIMUM RATINGS

@ T

= 25 C unless otherwise specified

Parameters/Test Conditions

Junction and Storage Temperature

Thermal Resistance Junction-to-End Cap

(1)

Thermal Resistance Junction-to-Ambient

Steady State Power Dissipation

@ T

≤ 115 ºC

(1)

@ T

= 25 ºC

Rated Average Power Dissipation (also see

figure 1)

Forward Voltage

@ 200 mA

Solder Temperature @ 10 s

Symbol

& T

STG

ӨJEC

ӨJA

M(AV)

Value

-65 to +175

120

1.5

1.25

1.5

1.2

260

Unit

C/W

MSC – Lawrence

6 Lake Street,

Lawrence, MA 01841

Tel: 1-800-446-1158 or

(978) 620-2600

Fax: (978) 689-0803

MSC – Ireland

Gort Road Business Park,

Ennis, Co. Clare, Ireland

Tel: +353 (0) 65 6840044

Fax: +353 (0) 65 6822298

Website:

www.microsemi.com

Notes:

1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).

T4-LDS-0300-1, Rev. 1 (6/6/13)

Page 1 of 5

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