IS61WV25616BLL-10BI-TR datasheet, PDF

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IS61WV25616BLL-10BI-TR: DescriptionStandard SRAM, 256KX16, 10ns, CMOS, PBGA48; Categorystorage storage; File Size422KB，22 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61WV25616BLL-10BI-TR Overview

Standard SRAM, 256KX16, 10ns, CMOS, PBGA48

IS61WV25616BLL-10BI-TR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
package instruction	FBGA, BGA48,6X8,30
Reach Compliance Code	compliant
Factory Lead Time	8 weeks
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum standby current	0.009 A
Minimum standby current	2 V
Maximum slew rate	0.045 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Base Number Matches	1

IS61WV25616BLL-10BI-TR Related Products

	IS61WV25616BLL-10BI-TR	IS64WV25616BLL-10CTLA3	IS64WV25616BLL-10BLA3-TR
Description	Standard SRAM, 256KX16, 10ns, CMOS, PBGA48	Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 256KX16, 10ns, CMOS, PBGA48
Is it Rohs certified?	incompatible	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Reach Compliance Code	compliant	compliant	compliant
Factory Lead Time	8 weeks	12 weeks	12 weeks
Maximum access time	10 ns	10 ns	10 ns
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48
memory density	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16
Number of terminals	48	44	48
word count	262144 words	262144 words	262144 words
character code	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	256KX16	256KX16	256KX16
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	TSOP2	FBGA
Encapsulate equivalent code	BGA48,6X8,30	TSOP44,.46,32	BGA48,6X8,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.009 A	0.015 A	0.015 A
Minimum standby current	2 V	2 V	2 V
Maximum slew rate	0.045 mA	0.065 mA	0.065 mA
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	GULL WING	BALL
Terminal pitch	0.75 mm	0.8 mm	0.75 mm
Terminal location	BOTTOM	DUAL	BOTTOM
package instruction	FBGA, BGA48,6X8,30	TSOP2, TSOP44,.46,32	-
Base Number Matches	1	1	-
Filter level	-	AEC-Q100	AEC-Q100

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