HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6332
Issued Date : 1995.05.18
Revised Date : 2002.04.11
Page No. : 1/3
HMPSA27
NPN SILICON TRANSISTOR
Description
The HMPSA27 is designed for darlington amplifier high current gain
collector current to 500mA.
Absolute Maximum Ratings
TO-92
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 625 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ......................................................................................... 60 V
VCES Collector to Emitter Voltage ...................................................................................... 60 V
VEBO Collector to Emitter Voltage ...................................................................................... 10 V
IC Collector Current........................................................................................................ 500 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCES
BVEBO
ICBO
IEBO
ICES
*VCE(sat)
VBE(on)
*hFE1
*hFE2
Min.
60
60
10
-
-
-
-
-
10K
10K
Typ.
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
100
100
500
1.5
2
-
-
Unit
V
V
V
nA
nA
nA
V
V
Test Conditions
IC=100uA, IE=0
IC=100uA, VBE=0
IE=10uA, IC=0
VCB=50V, IE=0
VEB=10V, IC=0
VCE=50V
IC=100mA, IB=0.1mA
VCE=5V, IC=100mA
VCE=5V, IC=10mA
VCE=5V, IC=100mA
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
HMPSA27
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100000
125 C
o
Spec. No. : HE6332
Issued Date : 1995.05.18
Revised Date : 2002.04.11
Page No. : 2/3
Saturation Voltage & Collector Current
10000
Saturation Voltage (mV)
75 C
1000
25 C
o
o
hFE
25 C
o
75 C
o
125 C
hFE @ V
CE
=5V
10000
10
100
1000
100
1
10
100
1000
V
CE(sat)
@ I
C
=1000I
B
o
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
ON Voltage & Collector Current
10000
Capacitance & Reverse-Biased Voltage
10
Capacitance (pF)
ON Voltage (mV)
Cob
25 C
1000
125 C
75 C
V
BE(ON)
@ V
CE
=5V
o
o
o
100
1
10
100
1000
1
0.1
1
10
100
Collector Current-I
C
(mA)
Reverse-Biased Voltage (V)
Safe Operating Area
10000
P
T
=1ms
PD-Ta
700
600
Collector Current-I
C
(mA)
1000
P
T
=1s
100
Power Dissipation-PD (mW)
10
100
P
T
=100ms
500
400
300
200
100
10
1
1
0
0
50
100
o
150
200
Forward Voltage-V
CE
(V)
Ambient Temperature-Ta ( C)
HMPSA27
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Spec. No. : HE6332
Issued Date : 1995.05.18
Revised Date : 2002.04.11
Page No. : 3/3
α
2
Marking:
H MP S
A 2 7
Control Code
α
3
C
Style: Pin 1.Emitter 2.Base 3.Collector
D
H
I
E
F
G
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMPSA27
HSMC Product Specification
Automotive Electronics
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