CDIP-22, Tube
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | CDIP |
| package instruction | DIP, DIP22,.3 |
| Contacts | 22 |
| Manufacturer packaging code | CD22 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 45 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-GDIP-T22 |
| JESD-609 code | e0 |
| length | 27.051 mm |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 22 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64KX1 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.001 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.09 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8601504YA | 5962-8601503YA | 5962-8601507YA | 5962-8601506YA | |
|---|---|---|---|---|
| Description | CDIP-22, Tube | CDIP-22, Tube | CDIP-22, Tube | CDIP-22, Tube |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | CDIP | CDIP | CDIP | CDIP |
| package instruction | DIP, DIP22,.3 | DIP, DIP22,.3 | DIP, DIP22,.3 | DIP, DIP22,.3 |
| Contacts | 22 | 22 | 22 | 22 |
| Manufacturer packaging code | CD22 | CD22 | CD22 | CD22 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Maximum access time | 45 ns | 45 ns | 70 ns | - |
| I/O type | SEPARATE | SEPARATE | SEPARATE | - |
| JESD-30 code | R-GDIP-T22 | R-GDIP-T22 | R-GDIP-T22 | - |
| JESD-609 code | e0 | e0 | e0 | - |
| length | 27.051 mm | 27.051 mm | 27.051 mm | - |
| memory density | 65536 bit | 65536 bit | 65536 bit | - |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - |
| memory width | 1 | 1 | 1 | - |
| Humidity sensitivity level | 1 | 1 | 1 | - |
| Number of functions | 1 | 1 | 1 | - |
| Number of ports | 1 | 1 | 1 | - |
| Number of terminals | 22 | 22 | 22 | - |
| word count | 65536 words | 65536 words | 65536 words | - |
| character code | 64000 | 64000 | 64000 | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - |
| organize | 64KX1 | 64KX1 | 64KX1 | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | - |
| Exportable | NO | NO | NO | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| encapsulated code | DIP | DIP | DIP | - |
| Encapsulate equivalent code | DIP22,.3 | DIP22,.3 | DIP22,.3 | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | IN-LINE | IN-LINE | - |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | - |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | - |
| power supply | 5 V | 5 V | 5 V | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | - |
| Maximum standby current | 0.001 A | 0.02 A | 0.02 A | - |
| Minimum standby current | 2 V | 4.5 V | 4.5 V | - |
| Maximum slew rate | 0.09 mA | 0.105 mA | 0.105 mA | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - |
| surface mount | NO | NO | NO | - |
| technology | CMOS | CMOS | CMOS | - |
| Temperature level | MILITARY | MILITARY | MILITARY | - |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | - |
| Terminal location | DUAL | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 7.62 mm | 7.62 mm | 7.62 mm | - |
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