77V252L155PG datasheet, PDF - EEWORLD Datasheet

77V252L155PG: DescriptionATM/SONET/SDH Segmentation and Reassembly Device, CMOS, PQFP208; CategoryWireless rf/communication Telecom circuit; File Size140KB，24 Pages; ManufacturerIDT (Integrated Device Technology)

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77V252L155PG Overview

ATM/SONET/SDH Segmentation and Reassembly Device, CMOS, PQFP208

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Reach Compliance Code	unknown
JESD-30 code	S-PQFP-G208
JESD-609 code	e0
Number of terminals	208
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP208,1.2SQ,20
Package shape	SQUARE
Package form	FLATPACK
power supply	3.3 V
Certification status	Not Qualified
Maximum slew rate	300 mA
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Base Number Matches	1

	77V252L155PG	77V252L155PGI
Description	ATM/SONET/SDH Segmentation and Reassembly Device, CMOS, PQFP208	ATM/SONET/SDH Segmentation and Reassembly Device, CMOS, PQFP208
Is it Rohs certified?	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Reach Compliance Code	unknown	unknown
JESD-30 code	S-PQFP-G208	S-PQFP-G208
JESD-609 code	e0	e0
Number of terminals	208	208
Maximum operating temperature	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP
Encapsulate equivalent code	QFP208,1.2SQ,20	QFP208,1.2SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	300 mA	300 mA
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Telecom integrated circuit types	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature level	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Base Number Matches	1	1

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