DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | GSI Technology |
Parts packaging code | BGA |
package instruction | 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
Contacts | 165 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 0.45 ns |
Other features | PIPELINE ARCHITECTURE |
JESD-30 code | R-PBGA-B165 |
JESD-609 code | e0 |
length | 15 mm |
memory density | 75497472 bit |
Memory IC Type | DDR SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 165 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 4MX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 13 mm |
Base Number Matches | 1 |