R5F571MJDDBG datasheet, PDF - EEWORLD Datasheet

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R5F571MJDDBG: DescriptionMICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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R5F571MJDDBG Overview

MICROCONTROLLER

R5F571MJDDBG Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
package instruction	LFBGA,
Reach Compliance Code	compliant
Has ADC	YES
Address bus width	24
bit size	32
maximum clock frequency	24 MHz
DAC channel	YES
DMA channel	YES
External data bus width	32
JESD-30 code	S-PBGA-B176
length	13 mm
Number of I/O lines	128
Number of terminals	176
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
RAM (bytes)	524288
rom(word)	3145728
ROM programmability	FLASH
Maximum seat height	1.4 mm
speed	240 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	13 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

R5F571MJDDBG Related Products

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Description	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	LFBGA,	LFQFP-100	LFQFP,	TFLGA-100	LFQFP,	LFQFP,	TFLGA-177	LFQFP,	LFBGA,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Has ADC	YES	YES	YES	YES	YES	YES	YES	YES	YES
Address bus width	24	24	24	24	24	24	24	24	24
bit size	32	32	32	32	32	32	32	32	32
maximum clock frequency	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz
DAC channel	YES	YES	YES	YES	YES	YES	YES	YES	YES
DMA channel	YES	YES	YES	YES	YES	YES	YES	YES	YES
External data bus width	32	16	16	16	16	32	32	32	32
JESD-30 code	S-PBGA-B176	S-PQFP-G100	S-PQFP-G144	S-PBGA-B100	S-PQFP-G144	S-PQFP-G176	S-PBGA-B177	S-PQFP-G176	S-PBGA-B176
length	13 mm	14 mm	20 mm	7 mm	20 mm	24 mm	8 mm	24 mm	13 mm
Number of I/O lines	128	79	112	79	112	128	128	128	128
Number of terminals	176	100	144	100	144	176	177	176	176
On-chip program ROM width	8	8	8	8	8	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP	LFQFP	TFLGA	LFQFP	LFQFP	TFLGA	LFQFP	LFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
RAM (bytes)	524288	524288	524288	524288	524288	524288	524288	524288	524288
rom(word)	3145728	3145728	2097152	3145728	3145728	3145728	2621440	3145728	2097152
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.4 mm	1.7 mm	1.7 mm	1.05 mm	1.7 mm	1.7 mm	1.05 mm	1.7 mm	1.4 mm
speed	240 MHz	240 MHz	240 MHz	240 MHz	240 MHz	240 MHz	240 MHz	240 MHz	240 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	BUTT	GULL WING	GULL WING	BUTT	GULL WING	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	QUAD	QUAD	BOTTOM	QUAD	QUAD	BOTTOM	QUAD	BOTTOM
width	13 mm	14 mm	20 mm	7 mm	20 mm	24 mm	8 mm	24 mm	13 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1	1	1	1	1	1	1	1

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