3 TO 8 LINE DECODER INVERTING
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Other features | 3 ENABLE INPUTS |
| series | HCT |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | OTHER DECODER/DRIVER |
| MaximumI(ol) | 0.004 A |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Prop。Delay @ Nom-Su | 45 ns |
| propagation delay (tpd) | 45 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| M54HCT138F1R | M74HCT138C1R | |
|---|---|---|
| Description | 3 TO 8 LINE DECODER INVERTING | 3 TO 8 LINE DECODER INVERTING |
| Is it Rohs certified? | incompatible | conform to |
| Maker | STMicroelectronics | STMicroelectronics |
| Parts packaging code | DIP | QFN |
| package instruction | DIP, DIP16,.3 | CC-20 |
| Contacts | 16 | 20 |
| Reach Compliance Code | _compli | compli |
| ECCN code | EAR99 | EAR99 |
| Other features | 3 ENABLE INPUTS | 3 ENABLE INPUTS |
| series | HCT | HCT |
| JESD-30 code | R-GDIP-T16 | S-PQCC-J20 |
| JESD-609 code | e0 | e3 |
| Load capacitance (CL) | 50 pF | 50 pF |
| Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| MaximumI(ol) | 0.004 A | 0.004 A |
| Number of functions | 1 | 1 |
| Number of terminals | 16 | 20 |
| Maximum operating temperature | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C |
| Output polarity | INVERTED | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ |
| Encapsulate equivalent code | DIP16,.3 | LDCC20,.4SQ |
| Package shape | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V |
| Prop。Delay @ Nom-Su | 45 ns | 38 ns |
| propagation delay (tpd) | 45 ns | 38 ns |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 4.57 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 8.9662 mm |
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