4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Mitsubishi |
| Parts packaging code | TSOP2 |
| package instruction | TSOP2, TSOP50,.46,32 |
| Contacts | 50 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| access mode | DUAL BANK PAGE BURST |
| Maximum access time | 12 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 83 MHz |
| I/O type | COMMON |
| interleaved burst length | 1,2,4,8 |
| JESD-30 code | R-PDSO-G50 |
| JESD-609 code | e0 |
| length | 20.95 mm |
| memory density | 4194304 bi |
| Memory IC Type | SYNCHRONOUS DRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 50 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSOP50,.46,32 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Maximum seat height | 1.2 mm |
| self refresh | YES |
| Continuous burst length | 1,2,4,8,FP |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.13 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| M5M4V4S40CTP-12 | M5M4V4S40CTP-15 | |
|---|---|---|
| Description | 4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM | 4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Mitsubishi | Mitsubishi |
| Parts packaging code | TSOP2 | TSOP2 |
| package instruction | TSOP2, TSOP50,.46,32 | TSOP2, TSOP50,.46,32 |
| Contacts | 50 | 50 |
| Reach Compliance Code | unknow | unknow |
| ECCN code | EAR99 | EAR99 |
| access mode | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| Maximum access time | 12 ns | 15 ns |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 83 MHz | 67 MHz |
| I/O type | COMMON | COMMON |
| interleaved burst length | 1,2,4,8 | 1,2,4,8 |
| JESD-30 code | R-PDSO-G50 | R-PDSO-G50 |
| JESD-609 code | e0 | e0 |
| length | 20.95 mm | 20.95 mm |
| memory density | 4194304 bi | 4194304 bi |
| Memory IC Type | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| memory width | 16 | 16 |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 50 | 50 |
| word count | 262144 words | 262144 words |
| character code | 256000 | 256000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 256KX16 | 256KX16 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | TSOP2 |
| Encapsulate equivalent code | TSOP50,.46,32 | TSOP50,.46,32 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified |
| refresh cycle | 1024 | 1024 |
| Maximum seat height | 1.2 mm | 1.2 mm |
| self refresh | YES | YES |
| Continuous burst length | 1,2,4,8,FP | 1,2,4,8,FP |
| Maximum standby current | 0.002 A | 0.002 A |
| Maximum slew rate | 0.13 mA | 0.11 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 10.16 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD