Cache SRAM, 64KX32, 8ns, CMOS, PQFP100, PLASTIC, TQFP-100
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | QFP |
package instruction | PLASTIC, TQFP-100 |
Contacts | 100 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 8 ns |
Other features | FLOW-THROUGH ARCHITECTURE |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
length | 20 mm |
memory density | 2097152 bit |
Memory IC Type | CACHE SRAM |
memory width | 32 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 65536 words |
character code | 64000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX32 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.63 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD (800) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 14 mm |
Base Number Matches | 1 |
CY7C1336L-100AC | CY7C1336L-117AC | CY7C1336-100AC | CY7C1336-117AC | |
---|---|---|---|---|
Description | Cache SRAM, 64KX32, 8ns, CMOS, PQFP100, PLASTIC, TQFP-100 | Cache SRAM, 64KX32, 7.5ns, CMOS, PQFP100, PLASTIC, TQFP-100 | Cache SRAM, 64KX32, 8ns, CMOS, PQFP100, PLASTIC, TQFP-100 | Cache SRAM, 64KX32, 7.5ns, CMOS, PQFP100, PLASTIC, TQFP-100 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
Parts packaging code | QFP | QFP | QFP | QFP |
package instruction | PLASTIC, TQFP-100 | PLASTIC, TQFP-100 | PLASTIC, TQFP-100 | PLASTIC, TQFP-100 |
Contacts | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 8 ns | 7.5 ns | 8 ns | 7.5 ns |
Other features | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
memory width | 32 | 32 | 32 | 32 |
Humidity sensitivity level | 3 | 3 | 3 | 3 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 100 | 100 |
word count | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 64KX32 | 64KX32 | 64KX32 | 64KX32 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP | LQFP | LQFP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD (800) | TIN LEAD (800) | TIN LEAD (800) | TIN LEAD (800) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 |
width | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | - |