Flash, 32MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | TFBGA, BGA84,10X12,32 |
Contacts | 84 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.A |
Maximum access time | 80 ns |
JESD-30 code | R-PBGA-B84 |
length | 11.6 mm |
memory density | 536870912 bit |
Memory IC Type | FLASH |
memory width | 16 |
Mixed memory types | FLASH+PSRAM |
Number of functions | 1 |
Number of terminals | 84 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 32MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA84,10X12,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 1.8 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
width | 8 mm |
Base Number Matches | 1 |