Dual-Port SRAM, 64KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FBGA-208
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | BGA |
package instruction | LFBGA, BGA208,17X17,32 |
Contacts | 208 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 15 ns |
Other features | PIPELINED OR FLOW-THROUGH ARCHITECTURE |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | S-PBGA-B208 |
JESD-609 code | e1 |
length | 15 mm |
memory density | 2359296 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 208 |
word count | 65536 words |
character code | 64000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64KX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA208,17X17,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5/3.3,3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.7 mm |
Maximum standby current | 0.04 A |
Minimum standby current | 3.15 V |
Maximum slew rate | 0.48 mA |
Maximum supply voltage (Vsup) | 3.45 V |
Minimum supply voltage (Vsup) | 3.15 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 15 mm |
Base Number Matches | 1 |