Multi-Port SRAM, 1KX9, 45ns, CMOS, PQCC52, PLASTIC, LCC-52
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | LCC |
package instruction | PLASTIC, LCC-52 |
Contacts | 52 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 45 ns |
JESD-30 code | S-PQCC-J52 |
JESD-609 code | e0 |
length | 19.1262 mm |
memory density | 9216 bit |
Memory IC Type | MULTI-PORT SRAM |
memory width | 9 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 52 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX9 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Minimum standby current | 2 V |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 19.1262 mm |
Base Number Matches | 1 |