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KM416C254BLLT-5

Description
EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, PLASTIC, TSOP2-40
Categorystorage    storage   
File Size796KB,36 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KM416C254BLLT-5 Overview

EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, PLASTIC, TSOP2-40

KM416C254BLLT-5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeTSOP2
package instructionTSOP2, TSOP40/44,.46,32
Contacts40
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time50 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O typeCOMMON
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length18.41 mm
memory density4194304 bit
Memory IC TypeEDO DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals40
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP40/44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height1.2 mm
self refreshYES
Maximum standby current0.0001 A
Maximum slew rate0.11 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
width10.16 mm
Base Number Matches1

KM416C254BLLT-5 Related Products

KM416C254BLLT-5 KM416C254BLLJ-6 KM416C254BLLTR-7 KM416C254BLLTR-6 KM416C254BLLJ-7 KM416C254BLLT-7 KM416C254BLLT-6 KM416C254BLLTR-5 KM416C254BLLJ-5
Description EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, PLASTIC, TSOP2-40 EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, PLASTIC, SOJ-40 EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, PLASTIC, REVERSE, TSOP2-40 EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, PLASTIC, REVERSE, TSOP2-40 EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, PLASTIC, SOJ-40 EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, PLASTIC, TSOP2-40 EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, PLASTIC, TSOP2-40 EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, PLASTIC, REVERSE, TSOP2-40 EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, PLASTIC, SOJ-40
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code TSOP2 SOJ TSOP2 TSOP2 SOJ TSOP2 TSOP2 TSOP2 SOJ
package instruction TSOP2, TSOP40/44,.46,32 SOJ, SOJ40,.44 TSOP2-R, TSOP40/44,.46,32 TSOP2-R, TSOP40/44,.46,32 SOJ, SOJ40,.44 TSOP2, TSOP40/44,.46,32 TSOP2, TSOP40/44,.46,32 TSOP2-R, TSOP40/44,.46,32 SOJ, SOJ40,.44
Contacts 40 40 40 40 40 40 40 40 40
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time 50 ns 60 ns 70 ns 60 ns 70 ns 70 ns 60 ns 50 ns 50 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G40 R-PDSO-J40 R-PDSO-G40 R-PDSO-G40 R-PDSO-J40 R-PDSO-G40 R-PDSO-G40 R-PDSO-G40 R-PDSO-J40
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 18.41 mm 25.535 mm 18.41 mm 18.41 mm 25.535 mm 18.41 mm 18.41 mm 18.41 mm 25.535 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM
memory width 16 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 40 40 40 40 40 40 40 40 40
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 SOJ TSOP2-R TSOP2-R SOJ TSOP2 TSOP2 TSOP2-R SOJ
Encapsulate equivalent code TSOP40/44,.46,32 SOJ40,.44 TSOP40/44,.46,32 TSOP40/44,.46,32 SOJ40,.44 TSOP40/44,.46,32 TSOP40/44,.46,32 TSOP40/44,.46,32 SOJ40,.44
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512 512
Maximum seat height 1.2 mm 3.56 mm 1.2 mm 1.2 mm 3.56 mm 1.2 mm 1.2 mm 1.2 mm 3.56 mm
self refresh YES YES YES YES YES YES YES YES YES
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.11 mA 0.09 mA 0.08 mA 0.09 mA 0.08 mA 0.08 mA 0.09 mA 0.11 mA 0.11 mA
Maximum supply voltage (Vsup) 5.25 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING J BEND GULL WING GULL WING J BEND GULL WING GULL WING GULL WING J BEND
Terminal pitch 0.8 mm 1.27 mm 0.8 mm 0.8 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
Maker SAMSUNG - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
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