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MBM29LV008TA-70PTR

Description
8M (1M X 8) BIT
Categorystorage    storage   
File Size263KB,51 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
Download Datasheet Parametric View All

MBM29LV008TA-70PTR Overview

8M (1M X 8) BIT

MBM29LV008TA-70PTR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP1
package instructionPLASTIC, REVERSE, TSOP1-40
Contacts40
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time70 ns
startup blockTOP
command user interfaceYES
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length18.4 mm
memory density8388608 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,15
Number of terminals40
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Encapsulate equivalent codeTSSOP40,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
power supply3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
reverse pinoutYES
Maximum seat height1.2 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
switch bitYES
typeNOR TYPE
width10 mm
Base Number Matches1
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20858-4E
FLASH MEMORY
CMOS
8M (1M
×
8) BIT
MBM29LV008TA
-70/-90/-12
/MBM29LV008BA
-70/-90/-12
s
FEATURES
• Single 3.0 V read, program, and erase
Minimizes system level power requirements
• Compatible with JEDEC-standard commands
Uses same software commands as E
2
PROMs
• Compatible with JEDEC-standard world-wide pinouts
40-pin TSOP(I) (Package suffix: PTN – Normal Bend Type, PTR – Reversed Bend Type)
• Minimum 100,000 program/erase cycles
• High performance
70 ns maximum access time
• Sector erase architecture
One 16K byte, two 8K bytes, one 32K byte, and fifteen 64K bytes
Any combination of sectors can be concurrently erased. Also supports full chip erase
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• Embedded Erase
TM
Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded Program
TM
Algorithms
Automatically writes and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode
• Low V
CC
write inhibit
2.5 V
• Erase Suspend/Resume
Suspends the erase operation to allow a read data in another sector within the same device
• Sector protection
Hardware method disables any combination of sectors from program or erase operations
• Sector Protection Set function by Extended sector protection command
• Temporary sector unprotection
Temporary sector unprotection via the RESET pin
Embedded Erase
TM
and Embedded Program
TM
are trademarks of Advanced Micro Devices, Inc.

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