INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 12000 µV |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-2.5/+-15 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| MC1456CP1 | MC1456 | MC1456G | MC1456C | MC1556 | MC1556U | MC1556G | MC1456P1 | MC1456CG | |
|---|---|---|---|---|---|---|---|---|---|
| Description | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER | INTERNALLY COMPENSATED, HIGH PERFORMANCE OPERATONAL AMPLIFIER |
| Is it Rohs certified? | incompatible | - | incompatible | - | - | incompatible | incompatible | incompatible | incompatible |
| Maker | Motorola ( NXP ) | - | Motorola ( NXP ) | - | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| Reach Compliance Code | unknow | - | unknow | - | - | unknow | unknow | unknow | unknow |
| Amplifier type | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | - | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | - | - | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | - | YES | - | - | YES | - | YES | YES |
| Maximum input offset voltage | 12000 µV | - | 14000 µV | - | - | 6000 µV | 6000 µV | 14000 µV | 12000 µV |
| JESD-30 code | R-PDIP-T8 | - | O-MBCY-W8 | - | - | R-CDIP-T8 | O-MBCY-W8 | R-PDIP-T8 | O-MBCY-W8 |
| JESD-609 code | e0 | - | e0 | - | - | e0 | e0 | e0 | e0 |
| low-dissonance | NO | - | NO | - | - | NO | - | NO | NO |
| Number of functions | 1 | - | 1 | - | - | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | - | 8 | - | - | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | - | 70 °C | - | - | 125 °C | 125 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | - | METAL | - | - | CERAMIC, METAL-SEALED COFIRED | METAL | PLASTIC/EPOXY | METAL |
| Encapsulate equivalent code | DIP8,.3 | - | CAN8,.2 | - | - | DIP8,.3 | - | DIP8,.3 | CAN8,.2 |
| Package shape | RECTANGULAR | - | ROUND | - | - | RECTANGULAR | ROUND | RECTANGULAR | ROUND |
| Package form | IN-LINE | - | CYLINDRICAL | - | - | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL |
| power supply | +-2.5/+-15 V | - | +-2.5/+-15 V | - | - | +-2.5/+-15 V | - | +-2.5/+-15 V | +-2.5/+-15 V |
| Certification status | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| technology | BIPOLAR | - | BIPOLAR | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | - | COMMERCIAL | - | - | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | WIRE | - | - | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE |
| Terminal location | DUAL | - | BOTTOM | - | - | DUAL | BOTTOM | DUAL | BOTTOM |
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