Dual-Port SRAM, 32KX16, 20ns, CMOS, CPGA108, CERAMIC, PGA-108
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | PGA |
package instruction | PGA, PGA108,12X12 |
Contacts | 108 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 20 ns |
Other features | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE |
I/O type | COMMON |
JESD-30 code | S-CPGA-P108 |
JESD-609 code | e0 |
length | 30.48 mm |
memory density | 524288 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 16 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 108 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX16 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Encapsulate equivalent code | PGA108,12X12 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.207 mm |
Maximum standby current | 0.015 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.285 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | 30 |
width | 30.48 mm |
Base Number Matches | 1 |