K9F1208U0C-PCB00 datasheet, PDF

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K9F1208U0C-PCB00: DescriptionFlash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, TSOP1-48; Categorystorage storage; File Size862KB，41 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K9F1208U0C-PCB00 Overview

Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, TSOP1-48

K9F1208U0C-PCB00 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP48,.8,20
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	30 ns
Other features	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY
command user interface	YES
Data polling	NO
JESD-30 code	R-PDSO-G48
length	20 mm
memory density	536870912 bit
Memory IC Type	FLASH
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	4K
Number of terminals	48
word count	67108864 words
character code	64000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
page size	512 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3.3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K
Maximum standby current	0.00005 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	SLC NAND TYPE
width	12 mm
Base Number Matches	1

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K9F1208U0C

K9F1208R0C K9F1208B0C

FLASH MEMORY

K9F1208X0C

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

K9F1208U0C-PCB00 Related Products

	K9F1208U0C-PCB00	K9F1208U0C-JIB00	K9F1208R0C-JCB00	K9F1208R0C-JIB0T	K9F1208B0C-PCB00	K9F1208R0C-JIB00	K9F1208U0C-PIB00	K9F1208B0C-PIB00	K9F1208U0C-JCB00
Description	Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, TSOP1-48	Flash, 64MX8, 30ns, PBGA63, 8.50 X 13 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-63	Flash, 64MX8, 30ns, PBGA63, 8.50 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-63	Flash, 64MX8, 30ns, PBGA63, 8.50 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-63	Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48	Flash, 64MX8, 30ns, PBGA63, 8.50 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-63	Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, TSOP1-48	Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48	Flash, 64MX8, 30ns, PBGA63, 8.50 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-63
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	TSOP1	BGA	BGA	BGA	TSOP1	BGA	TSOP1	TSOP1	BGA
package instruction	TSOP1, TSSOP48,.8,20	VFBGA, BGA63,10X12,32	VFBGA, BGA63,10X12,32	VFBGA, BGA63,10X12,32	TSOP1, TSSOP48,.8,20	VFBGA, BGA63,10X12,32	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP48,.8,20	VFBGA, BGA63,10X12,32
Contacts	48	63	63	63	48	63	48	48	63
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	unknown	unknown	compliant	unknow
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
Other features	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY	CONTAINS ADDITIONAL 16M BIT SPARE MEMORY
command user interface	YES	YES	YES	YES	YES	YES	YES	YES	YES
Data polling	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PDSO-G48	R-PBGA-B63	R-PBGA-B63	R-PBGA-B63	R-PDSO-G48	R-PBGA-B63	R-PDSO-G48	R-PDSO-G48	R-PBGA-B63
length	20 mm	13 mm	13 mm	13 mm	20 mm	13 mm	20 mm	20 mm	13 mm
memory density	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of departments/size	4K	4K	4K	4K	4K	4K	4K	4K	4K
Number of terminals	48	63	63	63	48	63	48	48	63
word count	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words
character code	64000000	64000000	64000000	64000000	64000000	64000000	64000000	64000000	64000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	85 °C	85 °C	70 °C
Minimum operating temperature	-	-40 °C	-	-40 °C	-	-40 °C	-40 °C	-40 °C	-
organize	64MX8	64MX8	64MX8	64MX8	64MX8	64MX8	64MX8	64MX8	64MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	VFBGA	VFBGA	VFBGA	TSOP1	VFBGA	TSOP1	TSOP1	VFBGA
Encapsulate equivalent code	TSSOP48,.8,20	BGA63,10X12,32	BGA63,10X12,32	BGA63,10X12,32	TSSOP48,.8,20	BGA63,10X12,32	TSSOP48,.8,20	TSSOP48,.8,20	BGA63,10X12,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3/3.3 V	3/3.3 V	1.8 V	1.8 V	2.7 V	1.8 V	3/3.3 V	2.7 V	3/3.3 V
Programming voltage	3.3 V	3.3 V	1.8 V	1.8 V	2.7 V	1.8 V	3.3 V	2.7 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	1.2 mm	1 mm	1 mm	1 mm	1.2 mm	1 mm	1.2 mm	1.2 mm	1 mm
Department size	16K	16K	16K	16K	16K	16K	16K	16K	16K
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	1.95 V	1.95 V	2.9 V	1.95 V	3.6 V	2.9 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	1.65 V	1.65 V	2.5 V	1.65 V	2.7 V	2.5 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	1.8 V	1.8 V	2.7 V	1.8 V	3.3 V	2.7 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal form	GULL WING	BALL	BALL	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.8 mm	0.8 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	DUAL	BOTTOM	BOTTOM	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM
switch bit	NO	NO	NO	NO	NO	NO	NO	NO	NO
type	SLC NAND TYPE	NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE
width	12 mm	8.5 mm	8.5 mm	8.5 mm	12 mm	8.5 mm	12 mm	12 mm	8.5 mm
Maker	SAMSUNG	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Humidity sensitivity level	3	3	-	3	-	3	3	-	-

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