LH534000BD-S datasheet, PDF - EEWORLD Datasheet

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LH534000BD-S: DescriptionMASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40; Categorystorage storage; File Size382KB，8 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH534000BD-S Overview

MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40

LH534000BD-S Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-40
Reach Compliance Code	unknown
Maximum access time	200 ns
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	40
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.6 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

LH534000BD-S Related Products

	LH534000BD-S	LH534000BTR-S	LH534000BN-S	LH534000BT-S
Description	MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 512KX8, 200ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48	MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40	MASK ROM, 512KX8, 200ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	SHARP	SHARP	SHARP	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-40	12 X 18 MM, PLASTIC, REVERSE, TSOP1-48	0.525 INCH, PLASTIC, SOP-40	12 X 18 MM, PLASTIC, TSOP1-48
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	200 ns	200 ns	200 ns	200 ns
JESD-30 code	R-PDIP-T40	R-PDSO-G48	R-PDSO-G40	R-PDSO-G48
JESD-609 code	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	40	48	40	48
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.6 V	2.6 V	2.6 V	2.6 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	1

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