Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Catalyst |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 8 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
length | 9.27 mm |
Number of terminals | 8 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 240 |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Maximum supply voltage | 6 V |
Minimum supply voltage | 2.7 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 7.62 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
Base Number Matches | 1 |