EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-R0202AS-02-2740-B

Description
RES,SMT,THIN FILM,274 OHMS,100WV,.1% +/-TOL,-50,50PPM TC,0202 CASE
CategoryPassive components    The resistor   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

WBC-R0202AS-02-2740-B Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-R0202AS-02-2740-B - - View Buy Now

WBC-R0202AS-02-2740-B Overview

RES,SMT,THIN FILM,274 OHMS,100WV,.1% +/-TOL,-50,50PPM TC,0202 CASE

WBC-R0202AS-02-2740-B Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1177341660
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
structureChip
Manufacturer's serial numberWBC(DISCRETE)
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package length0.508 mm
Package formSMT
Package width0.508 mm
method of packingTray
Rated power dissipation(P)0.25 W
resistance274 Ω
Resistor typeFIXED RESISTOR
seriesWBC(DISCRETE)
size code0202
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Tolerance0.1%
Operating Voltage100 V
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
A comprehensive Python 3 "cheat sheet"
...
dcexpert MicroPython Open Source section
FPGA implementation of high-speed dedicated GFP processor.pdf
FPGA implementation of high-speed dedicated GFP processor.pdf...
zxopenljx EE_FPGA Learning Park
MSP430Ware use notes to initialize XT1
1. Platform Description MSP430F5438 2. Why use MSPWare? Due to work reasons, STM32 is used more in school, and STM32 DriverLib is more convenient to use. When I first learned MSP430, I was back to the...
火辣西米秀 Microcontroller MCU
Battery charge calculation
Battery power calculationBattery manufacturers cannot provide an OCV meter that shows the capacity corresponding to the open circuit voltage, but this project must correctly display the battery power....
QWE4562009 Discrete Device
[Zero-knowledge ESP8266 tutorial] Quick Start 7- Make a buzzer
According to my previous sharing, we have learned to use buttons to control the brightness of LED lights. This time, we will apply what we have learned to real life! I believe you have all watched var...
roc2 stm32/stm8
High-performance machine learning makes edge computing more powerful
In today's world where technology is changing at a rapid pace, research in artificial intelligence (AI) has made amazing progress, and the uses of computers are constantly expanding. Machines can perf...
小螃蟹呀 ARM Technology

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号