STM32F101C6T6 datasheet, PDF - EEWORLD Datasheet

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STM32F101C6T6: DescriptionARM Microcontrollers - MCU 32BIT Cortex M3 32KB 6KB RAM 1X12 ADC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，87 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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ARM Microcontrollers - MCU 32BIT Cortex M3 32KB 6KB RAM 1X12 ADC

STM32F101C6T6 Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	QFP
package instruction	LFQFP, QFP48,.35SQ,20
Contacts	48
Reach Compliance Code	compliant
Samacsys Description	STM32F101C6T6, 32 bit ARM Cortex M3 Microcontroller 36MHz 32kb Flash, 6kb RAM, I2C SPI 48-Pin LQFP
Has ADC	YES
Address bus width
bit size	32
CPU series	CORTEX-M3
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G48
JESD-609 code	e3
length	7 mm
Humidity sensitivity level	1
Number of I/O lines	37
Number of terminals	48
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP48,.35SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	225
power supply	2.5/3.3 V
Certification status	Not Qualified
RAM (bytes)	6144
rom(word)	32768
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	36 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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STM32F101x4

STM32F101x6

Low-density access line, ARM

-based 32 bit MCU with

16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces

Datasheet

production data

Features

•

Core: ARM

32-bit Cortex

-M3 CPU

–

MHz maximum frequency,

1.25 DMIPS/MHz (Dhrystone 2.1)

performance

at 0 wait state memory

access

– Single-cycle multiplication and hardware

division

•

Memories

– 16 to 32 Kbytes of Flash memory

– 4 to 6 Kbytes of SRAM

•

Clock, reset and supply management

– 2.0 to 3.6 V application supply and I/Os

– POR, PDR and programmable voltage

detector (PVD)

– 4-to-16 MHz crystal oscillator

– Internal 8 MHz factory-trimmed RC

– Internal 40 kHz RC

– PLL for CPU clock

– 32 kHz oscillator for RTC with calibration

•

Low power

– Sleep, Stop and Standby modes

– V

BAT

supply for RTC and backup registers

•

Debug mode

– Serial wire debug (SWD) and JTAG

interfaces

•

DMA

– 7-channel DMA controller

– Peripherals supported: timers, ADC, SPIs,

Cs and USARTs

•

1 × 12-bit,

µs A/D converter (up to 16

channels)

– Conversion range: 0 to 3.6 V

– Temperature sensor

•

Up to 51 fast I/O ports

–

26/37/51

I/Os, all mappable on 16 external

interrupt vectors and almost all 5 V-tolerant

LQFP64

10 x 10 mm

LQFP48

7 x 7 mm

VFQFPN36

6 × 6 mm

•

Up to 5

timers

–

Up to two16-bit

timers, each with up to 4

IC/OC/PWM or pulse counter

– 2 watchdog timers (Independent and

Window)

– SysTick timer: 24-bit downcounter

•

Up to

communication interfaces

–

x I

C interface (SMBus/PMBus)

– Up to

USARTs

(ISO 7816 interface,

LIN,

IrDA capability, modem control)

– 1 × SPI (18 Mbit/s)

•

CRC calculation unit, 96-bit unique ID

•

ECOPACK

packages

Table 1. Device summary

Reference

STM32F101x4

Part number

STM32F101C4,

STM32F101R4,

STM32F101T4

STM32F101C6,

STM32F101R6,

STM32F101T6

STM32F101x6

September 2015

This is information on a product in full production.

DocID15058 Rev 6

1/87

www.st.com

Contents

STM32F101x4, STM32F101x6

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.1

2.2

2.3

Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.3.1

2.3.2

2.3.3

2.3.4

2.3.5

2.3.6

2.3.7

2.3.8

2.3.9

2.3.10

2.3.11

2.3.12

2.3.13

2.3.14

2.3.15

2.3.16

2.3.17

2.3.18

2.3.19

2.3.20

2.3.21

2.3.22

2.3.23

2.3.24

2.3.25

ARM

Cortex

-M3 core with embedded Flash and SRAM . . . . . . . . . 15

Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . 15

Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 15

External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . 16

Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

RTC (real-time clock) and backup registers . . . . . . . . . . . . . . . . . . . . . . 18

Independent watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

General-purpose timers (TIMx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Universal synchronous/asynchronous receiver transmitter (USART) . . 19

Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . 19

ADC (analog to digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 20

Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

2/87

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STM32F101x4, STM32F101x6

Contents

Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

5.1

Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

5.2

5.3

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

5.3.1

5.3.2

5.3.3

5.3.4

5.3.5

5.3.6

5.3.7

5.3.8

5.3.9

5.3.10

5.3.11

5.3.12

5.3.13

5.3.14

5.3.15

5.3.16

5.3.17

5.3.18

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 32

Embedded reset and power control block characteristics . . . . . . . . . . . 32

Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 51

I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

6.1

6.2

6.3

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

VFQFPN36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

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STM32F101x4, STM32F101x6

List of Tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Table 44.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Low-density STM32F101xx device features and peripheral counts . . . . . . . . . . . . . . . . . . 11

STM32F101xx family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Low-density STM32F101xx pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 33

Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Maximum current consumption in Run mode, code with data processing

running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Maximum current consumption in Run mode, code with data processing

running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Maximum current consumption in Sleep mode, code running from Flash

or RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 37

Typical current consumption in Run mode, code with data processing

running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Typical current consumption in Sleep mode, code running from Flash or RAM . . . . . . . . . 41

Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

HSE 4-16 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

LSE oscillator characteristics (f

LSE

= 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

SCL frequency (f

PCLK1

= MHz, V

DD_I2C

= 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

AIN

max for f

ADC

= 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

DocID15058 Rev 6

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STM32F101C6T6 Related Products

	STM32F101C6T6	STM32F101T6U6
Description	ARM Microcontrollers - MCU 32BIT Cortex M3 32KB 6KB RAM 1X12 ADC	ARM Microcontrollers - MCU 32BIT Cortex M3 FL ACCESS LINE ADV
Brand Name	STMicroelectronics	STMicroelectronics
Is it Rohs certified?	conform to	conform to
Maker	STMicroelectronics	STMicroelectronics
Parts packaging code	QFP	QFN
package instruction	LFQFP, QFP48,.35SQ,20	HVQCCN, LCC36,.25SQ,20
Contacts	48	36
Reach Compliance Code	compliant	compliant
Has ADC	YES	YES
bit size	32	32
CPU series	CORTEX-M3	CORTEX-M3
maximum clock frequency	16 MHz	16 MHz
DAC channel	NO	NO
DMA channel	YES	YES
JESD-30 code	S-PQFP-G48	S-XQCC-N36
JESD-609 code	e3	e3
length	7 mm	6 mm
Humidity sensitivity level	1	3
Number of I/O lines	37	26
Number of terminals	48	36
On-chip program ROM width	8	8
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
PWM channel	YES	YES
Package body material	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	LFQFP	HVQCCN
Encapsulate equivalent code	QFP48,.35SQ,20	LCC36,.25SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	225	260
power supply	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified
RAM (bytes)	6144	6144
rom(word)	32768	32768
ROM programmability	FLASH	FLASH
Maximum seat height	1.6 mm	1 mm
speed	36 MHz	36 MHz
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	2 V	2 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	Matte Tin (Sn) - annealed
Terminal form	GULL WING	NO LEAD
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	7 mm	6 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

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