|
DG441LDQ-T1 |
DG441LDY-T1 |
DG442LDJ |
DG441LAK |
DG442LDY-E3 |
DG442LAK |
Description |
Analog Switch ICs SPST Analog Switch |
Analog Switch ICs Lo-V Quad Mono SPST |
Analog Switch ICs SPST Analog Switch |
Analog Switch ICs Low Voltage Quad SPST CMOS Swtch |
USB Interface IC 256B HOST COM |
Analog Switch ICs Low Voltage Quad SPST CMOS Swtch |
Maker |
Vishay |
Vishay |
- |
Vishay |
Vishay |
Vishay |
package instruction |
TSSOP, TSSOP16,.25 |
SOP, SOP16,.25 |
- |
DIP, DIP16,.3 |
SOP, SOP16,.25 |
DIP, DIP16,.3 |
Reach Compliance Code |
unknown |
unknown |
- |
unknown |
unknown |
unknown |
Analog Integrated Circuits - Other Types |
DPDT |
SPST |
- |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDSO-G16 |
R-PDSO-G16 |
- |
R-GDIP-T16 |
R-PDSO-G16 |
R-GDIP-T16 |
normal position |
NC |
NC |
- |
NC |
NO |
NC |
Number of functions |
4 |
4 |
- |
4 |
4 |
4 |
Number of terminals |
16 |
16 |
- |
16 |
16 |
16 |
Maximum on-state resistance (Ron) |
100 Ω |
33 Ω |
- |
33 Ω |
33 Ω |
33 Ω |
Maximum operating temperature |
85 °C |
85 °C |
- |
125 °C |
85 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
- |
-55 °C |
-40 °C |
-55 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
- |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
encapsulated code |
TSSOP |
SOP |
- |
DIP |
SOP |
DIP |
Encapsulate equivalent code |
TSSOP16,.25 |
SOP16,.25 |
- |
DIP16,.3 |
SOP16,.25 |
DIP16,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
- |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
power supply |
+-3/+-6/3/12 V |
+-3/+-6/3/12 V |
- |
+-3/+-6/3/12 V |
+-3/+-6/3/12 V |
+-3/+-6/3/12 V |
Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
surface mount |
YES |
YES |
- |
NO |
YES |
NO |
Maximum connection time |
136 ns |
60 ns |
- |
83 ns |
60 ns |
83 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
BICMOS |
- |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
- |
MILITARY |
INDUSTRIAL |
MILITARY |
Terminal form |
GULL WING |
GULL WING |
- |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
0.635 mm |
1.27 mm |
- |
2.54 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
- |
DUAL |
DUAL |
DUAL |
Is it lead-free? |
- |
Contains lead |
- |
Contains lead |
Lead free |
Contains lead |
Parts packaging code |
- |
SOIC |
- |
DIP |
SOIC |
DIP |
Contacts |
- |
16 |
- |
16 |
16 |
16 |
Other features |
- |
ALSO OPERATES WITH 2.7V TO 12V SINGLE SUPPLY |
- |
ALSO OPERATES WITH 2.7V TO 12V SINGLE SUPPLY |
ALSO OPERATES WITH 2.7V TO 12V SINGLE SUPPLY |
ALSO OPERATES WITH 2.7V TO 12V SINGLE SUPPLY |
length |
- |
9.9 mm |
- |
19.305 mm |
9.9 mm |
19.305 mm |
Maximum negative supply voltage (Vsup) |
- |
-6 V |
- |
-6 V |
-6 V |
-6 V |
Negative supply voltage minimum (Vsup) |
- |
-3 V |
- |
-3 V |
-3 V |
-3 V |
Nominal Negative Supply Voltage (Vsup) |
- |
-5 V |
- |
-5 V |
-5 V |
-5 V |
Number of channels |
- |
1 |
- |
1 |
1 |
1 |
Nominal off-state isolation |
- |
68 dB |
- |
68 dB |
68 dB |
68 dB |
On-state resistance matching specifications |
- |
0.1 Ω |
- |
0.1 Ω |
0.1 Ω |
0.1 Ω |
Peak Reflow Temperature (Celsius) |
- |
240 |
- |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
Maximum seat height |
- |
1.75 mm |
- |
5.08 mm |
1.75 mm |
5.08 mm |
Maximum supply voltage (Vsup) |
- |
6 V |
- |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
- |
3 V |
- |
3 V |
3 V |
3 V |
Nominal supply voltage (Vsup) |
- |
5 V |
- |
5 V |
5 V |
5 V |
Maximum disconnect time |
- |
35 ns |
- |
55 ns |
35 ns |
55 ns |
Maximum time at peak reflow temperature |
- |
30 |
- |
NOT SPECIFIED |
40 |
NOT SPECIFIED |
width |
- |
3.9 mm |
- |
7.62 mm |
3.9 mm |
7.62 mm |