Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim |
Parts packaging code | QFN |
package instruction | HVQCCN, LCC16,.12SQ,20 |
Contacts | 24 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
app | ATM;SONET |
JESD-30 code | S-XQCC-N16 |
JESD-609 code | e0 |
length | 3 mm |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | HVQCCN |
Encapsulate equivalent code | LCC16,.12SQ,20 |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 0.8 mm |
Maximum slew rate | 0.0415 mA |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | BIPOLAR |
Telecom integrated circuit types | ATM/SONET/SDH SUPPORT CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3 mm |