Last update: 2015.12.25 No.RLP-K-HTS-0001-9
Specification
Title:
Style:
METAL-PLATE CHIP RESISTOR; LOW OHM
RLP16,20,32,63, MLP20,63
RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya
Note: Stock conditions
Temperature: +5
°
~ +35
°
C
C
Relative humidity: 25% ~ 75%
The period of guarantee: Within 2 year from shipment by the company.
Solderability shall be satisfied.
KMY
Title:
METAL−PLATE CHIP RESISTOR; LOW OHM
RLP16, 20, 32, 63, MLP20,63
Drawing No:
RLP−K−HTS−0001
Page:
1/19
/9
1. Scope
1.1 This specification covers the detail requirements for metal−plate chip resistor ; low ohm, style of RLP16, 20, 32, 63,
MLP20,63.
1.2 Applicable documents
JIS C 5201−1: 1998, JIS C 5201−8: 1998, JIS C 5201−8−1: 1998
IEC60115−1: 1999, IEC60115−8: 1989 Amendment 1: 1992, IEC60115−8−1: 1989
2. Classification
Type designation shall be the following form.
(Example)
RLP
63
R010
K
1
2
3
4
Style
1 Metal - plate chip resistor; low ohm
2 Size
3 Temperature coefficient of resistance
F
5
Style
N
K
−(Dash)
TE
6
±70×10
-6
/ °C
±100×10
-6
/ °C
±150×10
-6
/ °C
4 Rated resistance
5 Tolerance on rated resistance
6 Packaging form
3. Rating
3.1 The ratings shall be in accordance with Table−1.
Style
Rated dissipation
(W)
0.33
5.7
11.1
10.0
9.1
RLP20
0.5
7.9
7.4
7.0
MLP20
1.0
10.0
Rated current
(A)
8.1
RLP16
Table−1(1)
Temperature coefficient of
resistance (10
–6
/ °C)
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
Rated resistance
(mΩ)
5
10
4
5
6
8
9
10
10
F(±1%)
J(±5%)
Tolerance on rated
resistance
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.12.25
KMY
Title:
METAL−PLATE CHIP RESISTOR; LOW OHM
RLP16, 20, 32, 63, MLP20,63
Drawing No:
RLP−K−HTS−0001
Page:
2/19
/9
Style
Rated dissipation
(W)
Rated current
(A)
31.6
22.3
18.2
15.8
14.1
12.9
RLP32
1.0
11.9
11.1
10.5
10
9.1
8.7
8.1
Table−1(2)
Temperature coefficient of
resistance (10
–6
/ °C)
±150
−(Standard)
K
±100
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
Rated resistance
(mΩ)
1
2
3
4
5
6
7
8
9
10
12
13
15
Tolerance on rated
resistance
F(±1%)
J(±5%)
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.12.25
KMY
Title:
METAL−PLATE CHIP RESISTOR; LOW OHM
RLP16, 20, 32, 63, MLP20,63
Drawing No:
RLP−K−HTS−0001
Page:
3/19
/9
Style
Rated dissipation
(W)
2.0
Rated current
(A)
44.7
22.3
18.2
15.8
14.1
12.9
RLP63
1.0
11.9
11.1
10.5
10
9.1
8.1
63.2
36.5
31.6
28.2
25.8
22.3
MＬP63
2.0
20
18.2
16.9
15.8
14.9
14.1
Table−1(3)
Temperature coefficient of
resistance (10
–6
/ °C)
±150
−(Standard)
K
±100
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
±100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
Rated resistance
(mΩ)
1
2
3
4
5
6
7
8
9
10
12
15
0.5
1.5
2
2.5
3
4
5
6
7
8
9
10
Tolerance on rated
resistance
F(±1%)
J(±5%)
J(±5%)
F(±1%)
J(±5%)
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.12.25
KMY
Title:
METAL−PLATE CHIP RESISTOR; LOW OHM
RLP16, 20, 32, 63, MLP20,63
Table−1(4)
Isolation voltage
Category temperature range
(V)
(°C)
Drawing No:
RLP−K−HTS−0001
Page:
4/19
/9
Style
RLP16
RLP20
MLP20
RLP32
RLP63
MLP63
100
−55∼+155
3.2 Climatic category
55/155/56
Lower category temperature
Upper category temperature
Duration of the damp heat, steady state test
Limits for change of resistance:
−for
long−term tests
±5%
−for
short−term tests
±1%
−55
°C
+155
°C
56days
3.3 Stability class
5%
3.4 Derating
The derated values of dissipation at temperature in excess of 70 °C shall be as indicated by the following curve.
100
Percentage
of the rated
dissipation
(%)
0
−55
155
70
Ambient temperature (°C)
Area of recommended
operation
Figure−1 Derating curve
3.5 Rated voltage
d.c. or a.c. r.m.s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E: Rated voltage (V)
E =
P · R
P: Rated dissipation (W)
R: Rated resistance (Ω)
3.6 Rated current
The rated current calculated from the square root of the quotient of the rated resistance and the rated dissipation.
I: Rated current (A)
I =
P / R
P: Rated dissipation (W)
R: Rated resistance (Ω)
The rated current shall be corresponding to rated voltage.
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Standard packaging
Packaging form
Application
Symbol
quantity / units
TP
Paper taping
8mm width, 4mm pitches
5,000 pcs.
RLP16, 20, 32, MLP20
TE
Embossed taping
12mm width, 4mm pitches
4,000 pcs.
RLP63, MLP63
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.12.25
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