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TPCA8010-HTE12LQM

Description
MOSFET MOSFET N-Ch 200V 5.5A
Categorysemiconductor    Discrete semiconductor   
File Size210KB,7 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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MOSFET MOSFET N-Ch 200V 5.5A

TPCA8010-HTE12LQM Parametric

Parameter NameAttribute value
Product CategoryMOSFET
ManufacturerToshiba Semiconductor
RoHSDetails
TechnologySi
Mounting StyleSMD/SMT
Package / CaseSOP-Advance-8
Number of Channels1 Channel
Transistor PolarityN-Channel
Vds - Drain-Source Breakdown Voltage200 V
Id - Continuous Drain Current5.5 A
Rds On - Drain-Source Resistance380 mOhms
Vgs th - Gate-Source Threshold Voltage4 V
Vgs - Gate-Source Voltage20 V
Qg - Gate Charge3.7 nC
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 150 C
ConfigurationSingle Quad Drain Triple Source
Channel ModeEnhancement
PackagingReel
PackagingMouseReel
PackagingCut Tape
Fall Time13 ns
Forward Transconductance - Min3.9 S
Height0.95 mm
Length5 mm
Pd - Power Dissipation45 W
Rise Time8 ns
Factory Pack Quantity3000
Transistor Type1 N-Channel
Width5 mm
Unit Weight0.030018 oz
TPCA8010-H
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (MACHⅡπ-MOSⅤ)
TPCA8010-H
High-Speed Switching Applications
Switching Regulator Applications
DC-DC Converter Applications
6.0±0.3
Unit: mm
0.5±0.1
1.27
8
0.4±0.1
5
0.05 M A
Small footprint due to a small and thin package
High-speed switching
Small gate charge: Q
SW
= 3.7 nC (typ.)
5.0±0.2
0.15±0.05
1
0.95±0.05
4
0.595
A
High forward transfer admittance: |Y
fs
| = 3.9S (typ.)
Low leakage current: I
DSS
= 100
μA
(max) (V
DS
= 200V)
Enhancement mode: V
th
= 2.0 to 4.0 V (V
DS
= 10 V, I
D
= 1 mA)
5.0±0.2
S
1
4
0.6±0.1
4.25±0.2
Characteristic
Drain-source voltage
Drain-gate voltage (R
GS
=
20 kΩ)
Gate-source voltage
Drain current
DC
(Note 1)
Symbol
V
DSS
V
DGR
V
GSS
I
D
I
DP
P
D
P
D
P
D
E
AS
I
AR
Rating
200
200
±20
5.5
11
45
2.8
Unit
8
V
V
V
A
W
W
5 0.8±0.1
1, 2, 3 : SOURCE
4 : GATE
5, 6, 7, 8 : DRAIN
JEDEC
JEITA
TOSHIBA
2-5Q1A
Pulsed (Note 1)
(Tc=25℃)
(t
=
10 s)
(Note 2a)
Drain power dissipation
Drain power dissipation
Weight: 0.069 g (typ.)
Drain power dissipation
(t
=
10 s)
(Note 2b)
1.6
W
Circuit Configuration
8
7
6
5
Single-pulse avalanche energy
(Note 3)
Avalanche current
Repetitive avalanche energy
(Tc=25℃) (Note 4)
Channel temperature
Storage temperature range
19
5.5
1.5
150
−55
to 150
mJ
A
mJ
°C
°C
E
AR
T
ch
T
stg
1
2
3
3.5±0.2
Absolute Maximum Ratings
(Ta
=
25°C)
1.1±0.2
0.05 S
0.166±0.05
Low drain-source ON-resistance: R
DS (ON)
= 0.38Ω (typ.)
4
Note: For Notes 1 to 4, refer to the next page.
Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the
absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.
1
2009-12-21

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