HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2000.10.01
Page No. : 1/3
HAD826SP
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HAD826SP is designed for general purpose amplifier and high speed, medium-power switching
applications.
Features
•
Low Collector Saturation Voltage
•
High Speed Switching
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature....................................................................................................... -55 ~ +150
°C
Junction Temperature ................................................................................................. 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ........................................................................................... 500 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage..................................................................................................... 75 V
VCEO Collector to Emitter Voltage ................................................................................................. 40 V
VEBO Emitter to Base Voltage ......................................................................................................... 6 V
IC Collector Current .................................................................................................................. 500 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
ICEX
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
*hFE1
*hFE2
*hFE3
*hFE4
*hFE5
*hFE6
fT
Cob
Min.
75
40
6
-
-
-
-
-
-
-
35
50
75
100
40
50
300
-
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
10
10
50
300
1
1.2
2
-
-
-
300
-
-
-
8
Unit
V
V
V
nA
nA
nA
mv
V
V
V
Test Conditions
IC=10uA, IE=0
IC=10mA, IB=0
IE=10uA, IC=0
VCB=60V, IE=0
VCB=60V, VEB(OFF)=3V
VEB=3V, IC=0
IC=150mA, IB=15mA
IC=500mA, IB=50mA
IC=150mA, IB=15mA
IC=500mA, IB=50mA
VCE=10V, IC=100uA
VCE=10V, IC=1mA
VCE=10V, IC=10mA
VCE=10V, IC=150mA
VCE=10V, IC=500mA
VCE=1V, IC=150mA
VCE=20V, IC=20mA, f =100MHz
VCB=10V, f=1MHz
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
10000
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2000.10.01
Page No. : 2/3
Saturation Voltage & Collector Current
V
CE
=10V
V
CE
=1V
100
Saturation Voltage (mV)
1000
V
BE(sat)
@ I
C
=10I
B
hFE
100
V
CE(sat)
@ I
C
=10I
B
10
0.1
1
10
100
1000
10
0.1
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
fT
100
Capacitance (pF)
10
Cob
10
1
0.1
1
10
100
1000
1
1
10
100
1000
Reverse Biased Voltage (V)
Collector Current (mA)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92SP Dimension
Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2000.10.01
Page No. : 3/3
Style : Pin 1.Emitter 2.Collector 3.Base
E
3
A
2
1
B
C
D
F
G
3-Lead TO-92SP Plastic Package, HSMC Package Code : N
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.1450
0.1650
0.1063
0.1300
0.5000
-
-
*0.1000
Millimeters
Min.
Max.
3.70
4.20
2.70
3.30
12.7
-
-
*2.54
DIM
E
F
G
Inches
Min.
Max.
0.0160
0.0240
-
*0.0150
0.0800
0.1050
Millimeters
Min.
Max.
0.41
0.61
-
*0.38
2.03
2.67
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification