|
MIC4427ZM |
MIC4426ZM-TR |
MIC4427YM |
MIC4428YMM-TR |
MIC4426YN |
MIC4428YN |
MIC4426YMM-TR |
Description |
Operational Amplifiers - Op Amps DUAL LOW POWER 10 MHZ RRIO OP AMP |
Power Switch ICs - Power Distribution SMART HI SIDE SWITCH .4A |
Capacitive Touch Sensors 2Ch diff Touch u0026 Proximity Outputs |
Gate Drivers |
Gate Drivers 9-Ampere Low-Side Ultrafast MOSFET |
Slide Switches 1K2 ACT GOLD STRT MNT RED |
Fixed Inductors 47uH -40 +150 C AEC-Q200 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
package instruction |
SOP, |
SOP, |
SOIC-8 |
TSSOP, |
DIP, |
DIP, |
TSSOP, |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
16 weeks |
6 weeks |
6 weeks |
9 weeks |
2 weeks |
26 weeks |
Maker |
Microchip |
Microchip |
Microchip |
Microchip |
- |
- |
- |
high side driver |
- |
NO |
NO |
NO |
NO |
NO |
NO |
Interface integrated circuit type |
- |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
JESD-30 code |
- |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDIP-T8 |
R-PDIP-T8 |
R-PDSO-G8 |
JESD-609 code |
- |
e4 |
e4 |
e4 |
e3 |
e3 |
e4 |
length |
- |
4.9 mm |
4.9 mm |
3 mm |
9.525 mm |
9.525 mm |
3 mm |
Humidity sensitivity level |
- |
3 |
1 |
1 |
- |
- |
1 |
Number of functions |
- |
2 |
2 |
2 |
2 |
2 |
2 |
Number of terminals |
- |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
- |
70 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Nominal output peak current |
- |
1.5 A |
1.5 A |
1.5 A |
1.5 A |
1.5 A |
1.5 A |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
SOP |
SOP |
TSSOP |
DIP |
DIP |
TSSOP |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
260 |
NOT APPLICABLE |
NOT APPLICABLE |
260 |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
- |
1.879 mm |
1.879 mm |
1.09 mm |
- |
- |
1.09 mm |
Maximum supply voltage |
- |
18 V |
18 V |
18 V |
18 V |
18 V |
18 V |
Minimum supply voltage |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
surface mount |
- |
YES |
YES |
YES |
NO |
NO |
YES |
technology |
- |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
- |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
- |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
- |
1.27 mm |
1.27 mm |
0.65 mm |
2.54 mm |
2.54 mm |
0.65 mm |
Terminal location |
- |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
- |
40 |
40 |
40 |
NOT APPLICABLE |
NOT APPLICABLE |
40 |
Disconnect time |
- |
0.06 µs |
0.06 µs |
0.06 µs |
0.06 µs |
0.06 µs |
0.06 µs |
connection time |
- |
0.04 µs |
0.04 µs |
0.04 µs |
0.04 µs |
0.04 µs |
0.04 µs |
width |
- |
3.9 mm |
3.9 mm |
2.97 mm |
7.62 mm |
7.62 mm |
2.97 mm |
Base Number Matches |
- |
- |
1 |
- |
1 |
1 |
1 |