FPGA - Field Programmable Gate Array ProASIC3
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Microsemi |
| package instruction | BGA, BGA256,16X16,40 |
| Reach Compliance Code | compliant |
| maximum clock frequency | 350 MHz |
| JESD-30 code | S-PBGA-B256 |
| JESD-609 code | e1 |
| length | 17 mm |
| Humidity sensitivity level | 3 |
| Configurable number of logic blocks | 6144 |
| Equivalent number of gates | 250000 |
| Number of entries | 157 |
| Number of logical units | 6144 |
| Output times | 157 |
| Number of terminals | 256 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 6144 CLBS, 250000 GATES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA256,16X16,40 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 1.5/3.3 V |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| Filter level | AEC-Q100 |
| Maximum seat height | 1.8 mm |
| Maximum supply voltage | 1.575 V |
| Minimum supply voltage | 1.425 V |
| Nominal supply voltage | 1.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 17 mm |
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