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PI3B3125QE

Description
Digital Bus Switch ICs 3.3V 4B Bus Switch
Categorylogic    logic   
File Size1MB,10 Pages
ManufacturerPericom Semiconductor Corporation (Diodes Incorporated)
Websitehttps://www.diodes.com/
Environmental Compliance
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PI3B3125QE Overview

Digital Bus Switch ICs 3.3V 4B Bus Switch

PI3B3125QE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPericom Semiconductor Corporation (Diodes Incorporated)
Parts packaging codeSOIC
package instructionSSOP, SSOP16,.25
Contacts16
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresBUS SWITCH
seriesCBTLV/3B
JESD-30 codeR-PDSO-G16
JESD-609 codee3
length4.9 mm
Logic integrated circuit typeBUS DRIVER
Humidity sensitivity level1
Number of digits4
Number of functions1
Number of ports2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply3.3 V
propagation delay (tpd)0.25 ns
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN (787)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9116 mm
Base Number Matches1

PI3B3125QE Related Products

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Description Digital Bus Switch ICs 3.3V 4B Bus Switch Digital Bus Switch ICs 3.3V 4B Bus Switch Digital Bus Switch ICs 3.3V 4B Bus Switch Digital Bus Switch ICs 3.3V 4B Bus Switch
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated) Pericom Semiconductor Corporation (Diodes Incorporated)
Parts packaging code SOIC TSSOP TSSOP SOIC SOIC
package instruction SSOP, SSOP16,.25 TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25 SSOP, SSOP16,.25 SOP,
Contacts 16 14 14 16 14
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Other features BUS SWITCH BUS SWITCH BUS SWITCH BUS SWITCH BUS SWITCH
series CBTLV/3B CBTLV/3B CBTLV/3B CBTLV/3B CBTLV/3B
JESD-30 code R-PDSO-G16 R-PDSO-G14 R-PDSO-G14 R-PDSO-G16 R-PDSO-G14
JESD-609 code e3 e3 e3 e3 e3
length 4.9 mm 5 mm 5 mm 4.9 mm 8.65 mm
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Humidity sensitivity level 1 1 1 1 1
Number of digits 4 4 4 4 4
Number of functions 1 1 1 1 1
Number of ports 2 2 2 2 2
Number of terminals 16 14 14 16 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP TSSOP TSSOP SSOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260
propagation delay (tpd) 0.25 ns 0.25 ns 0.25 ns 0.25 ns 0.25 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.2 mm 1.2 mm 1.75 mm 1.75 mm
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN (787) MATTE TIN (787) MATTE TIN (787) MATTE TIN (787) MATTE TIN (787)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.635 mm 0.65 mm 0.65 mm 0.635 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40
width 3.9116 mm 4.4 mm 4.4 mm 3.9116 mm 3.9 mm
Base Number Matches 1 1 1 1 1
Encapsulate equivalent code SSOP16,.25 TSSOP14,.25 TSSOP14,.25 SSOP16,.25 -
power supply 3.3 V 3.3 V 3.3 V 3.3 V -

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