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DS1250W-150

Description
NVRAM 3.3V 4096K NV SRAM
Categorystorage    storage   
File Size202KB,9 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS1250W-150 Overview

NVRAM 3.3V 4096K NV SRAM

DS1250W-150 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
package instruction0.740 INCH, DIP-32
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Maximum access time150 ns
JESD-30 codeR-XDMA-P32
JESD-609 codee0
memory density4194304 bit
Memory IC TypeNON-VOLATILE SRAM MODULE
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Package body materialUNSPECIFIED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.00015 A
Maximum slew rate0.085 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
19-5648; Rev 12/10
DS1250W
3.3V 4096k Nonvolatile SRAM
www.maxim-ic.com
FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Replaces 512k x 8 volatile static RAM,
EEPROM or Flash memory
Unlimited write cycles
Low-power CMOS
Read and write access times of 100ns
Lithium energy source is electrically
disconnected to retain freshness until power is
applied for the first time
Optional industrial temperature range of -
40°C to +85°C, designated IND
JEDEC standard 32-pin DIP package
PowerCap Module (PCM) package
– Directly surface-mountable module
– Replaceable snap-on PowerCap provides
lithium backup battery
– Standardized pinout for all nonvolatile
SRAM products
– Detachment feature on PCM allows easy
removal using a regular screwdriver
PIN ASSIGNMENT
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
A17
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
32-Pin Encapsulated Package
740-Mil Extended
NC
A15
A16
NC
V
CC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
GND V
BAT
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
A18
A17
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
34-Pin PowerCap Module (PCM)
(Uses DS9034PC+ or DS9034PCI+ PowerCap)
PIN DESCRIPTION
A0 - A18
DQ0 - DQ7
CE
WE
OE
V
CC
GND
NC
1 of 11
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Power (+3.3V)
- Ground
- No Connect

DS1250W-150 Related Products

DS1250W-150 DS1250WP-100IND DS1250W-100 DS1250WP-150-C01
Description NVRAM 3.3V 4096K NV SRAM NVRAM 3.3V 4096K NV SRAM NVRAM 3.3V 4096K NV SRAM NVRAM 3.3V 4096K NV SRAM
Is it Rohs certified? incompatible incompatible - incompatible
Maker Maxim Maxim - Maxim
Reach Compliance Code not_compliant not_compliant - compliant
ECCN code 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A
Maximum access time 150 ns 100 ns - 150 ns
JESD-30 code R-XDMA-P32 R-XDMA-U34 - R-XDMA-U34
JESD-609 code e0 e0 - e0
memory density 4194304 bit 4194304 bit - 4194304 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE - NON-VOLATILE SRAM MODULE
memory width 8 8 - 8
Number of functions 1 1 - 1
Number of terminals 32 34 - 34
word count 524288 words 524288 words - 524288 words
character code 512000 512000 - 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C - 70 °C
organize 512KX8 512KX8 - 512KX8
Package body material UNSPECIFIED UNSPECIFIED - UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL - PARALLEL
Peak Reflow Temperature (Celsius) 240 NOT SPECIFIED - NOT SPECIFIED
Certification status Not Qualified Not Qualified - Not Qualified
Maximum supply voltage (Vsup) 3.6 V 3.6 V - 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V - 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V - 3.3 V
surface mount NO YES - YES
technology CMOS CMOS - CMOS
Temperature level COMMERCIAL INDUSTRIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) TIN LEAD - TIN LEAD
Terminal form PIN/PEG J INVERTED - J INVERTED
Terminal location DUAL DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED

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