Revision 3.1
Published by
IDA Team in Hynix Semiconductor Inc.
¨ Ï
Hynix Semiconductor 2001. All Right Reserved.
Hynix Offices in Korea or Distributors and Representatives listed at address directory may
serve additional information of this manual.
Hynix reserves the right to make changes to any Information here in at any time without
notice.
The information, diagrams, and other data in this manual are correct and reliable;
however, Hynix is in no way responsible for any violations of patents or other rights of
the third party generated by the use of this manual.
Specifications and information in this document are subject to change without notice and do
not represent a commitment on the part of Hynix. Hynix reserves the right to make changes
to improve functioning. Although the information in this document has been carefully
reviewed, Hynix does not assume any liability arising out of the use of the product or circuit
described herein.
Hynix does not authorize the use of the Hynix microprocessor in life support applications
wherein a failure or malfunction of the microprocessor may directly threaten life or cause
injury. The user of the Hynix microprocessor in life support applications assumes all risks of
such use and indemnifies Hynix against all damages.
For further information please contact:
SEOUL OFFICE : Hynix YOUNG DONG Bldg.
891, Daechi-dong, Kangnam-gu,
Seoul, Korea.
PHONE : (02) 3459-3662~3
FAX
SYSTEM IC
: (02) 3459-3942
: 1, Hyangjeong-dong, Hungduk-gu,
Cheongju, 361-725, Korea.
PHONE : (0431) 270-4030~47
FAX
: (0431) 270-4075
©
Copyright 2001Hynix Semiconductor Inc.
Revision Jun. 29, 2001.
Table of Contents
i
Table of Contents
0. Overview
0.1 GMS30C2216/32 RISC/DSP.............................................................................. 0-1
0.2 Block Diagram.................................................................................................... 0-8
0.3 Pin Configuration................................................................................................ 0-9
0.3.1 GMS30C2232, 160-Pin MQFP-Package - View from Top Side ........ 0-9
0.3.2 Pin Cross Reference by Pin Name .................................................... 0-10
0.3.2 Pin Cross Reference by Location ...................................................... 0-11
0.3.4 Pin Fuction ........................................................................................ 0-12
1. Architecture
1.1 Introduction...................................................................................................... 1-1
1.1.1 RISC Architecture ............................................................................... 1-1
1.1.2 Techniques to reduce CPI (Cycles per Instruction)............................. 1-2
1.1.3 The pipeline structure of GMS30C2232 ............................................. 1-7
1.2 Global Register Set .......................................................................................... 1-8
1.2.1 Program Counter PC, G0 .................................................................... 1-9
1.2.2 Status Register SR, G1 ...................................................................... 1-10
1.2.3 Floating-Point Exception Register FER, G2 ..................................... 1-13
1.2.4 Stack Pointer SP, G18 ....................................................................... 1-14
1.2.5 Upper Stack Bound UB, G19 ............................................................ 1-14
1.2.6 Bus Control Register BCR, G20 ....................................................... 1-14
1.2.7 Timer Prescaler Register TPR, G21 .................................................. 1-15
1.2.8 Timer Compare Register TCR, G22.................................................. 1-15
1.2.9 Timer Register TR, G23.................................................................... 1-15
1.2.10 Watchdog Compare Register WCR, G24........................................ 1-15
1.2.11 Input Status Register ISR, G25 ....................................................... 1-15
1.2.12 Function Control Register FCR, G26.............................................. 1-15
1.2.13 Memory Control Register MCR, G27............................................. 1-16
1.3 Local Register Set.......................................................................................... 1-16
1.4 Privilege States .............................................................................................. 1-17
1.5 Register Data Types....................................................................................... 1-18
1.6 Memory Organization.................................................................................... 1-19
1.7 Stack............................................................................................................... 1-21
1.8 Instruction Cache ........................................................................................... 1-26
1.9 On-Chip Memory (IRAM)............................................................................. 1-29